Abstract: An improved three-dimensional topographical model comprised of a plurality of layers having curvilinear apertures therethrough. The layers are stacked upon each other to form a three-dimensional hollow structure. The individual layers are cut from at least two motherboards and each layer is marked with a contour line to indicate the location on which the subsequent layer is stacked. During assembly, the outermost topographical layer of a first motherboard is removed and placed on a support member, thus constituting the first or bottom layer of the model. The outermost topographical layer of the second motherboard is removed and placed on top of the first layer, and subsequent layers are alternately removed from each of any remaining motherboards and stacked so that the margin of each layer overlaps the margin of the previous layer. This process is repeated until all layers are utilized and the model is fully formed. A model having steep inclines will require a greater number of motherboards.