Abstract: A method and materials for drilling through-holes in printed circuit boards with a drilling tool is disclosed. The method involves the use of a lubricating entry material placed on the top surface of a stack of printed circuit boards and a lubricating backup board placed beneath the bottom surface of the stack of printed circuit boards. The lubricating entry material has a core with skins attached on both sides by a lubricant/adhesive. Similarly, the backup board has a core with skins attached on both sides by a lubricant/adhesive. The skins are hard enough to support the top and bottom surfaces of the printed circuit boards and thereby reduce burring at the entry point and exit point of the through-hole. The lubricant/adhesive coats the drilling tool during the drilling operation to reduce friction and thereby reduce the temperature of the drilling tool.