Abstract: A mobile platform has a separate and independent linear actuator pivotally connected near each opposite end of the platform where there is a contact limit switch that when triggered by contact with the side of a flatbed, stops movement of the actuator, and thus stops movement of the platform, toward the side of the flatbed. Because each of the two actuators is pivotally connected to its respective end of the platform and moves independently of the other, each end of the platform can stop moving toward the flatbed before or after, depending on how the flatbed is misaligned, the other end of the platform stops moving toward the flatbed. In this way the platform self-aligns to the alignment of the flatbed and avoids the need to reposition a flatbed that is not precisely aligned parallel to the central axis of the loading bay.

Abstract: A mobile platform has a separate and independent linear actuator pivotally connected near each opposite end of the platform where there is a contact limit switch that when triggered by contact with the side of a flatbed, stops movement of the actuator, and thus stops movement of the platform, toward the side of the flatbed. Because each of the two actuators is pivotally connected to its respective end of the platform and moves independently of the other, each end of the platform can stop moving toward the flatbed before or after, depending on how the flatbed is misaligned, the other end of the platform stops moving toward the flatbed. In this way the platform self-aligns to the alignment of the flatbed and avoids the need to reposition a flatbed that is not precisely aligned parallel to the central axis of the loading bay.

Abstract: Methods and apparatus for burn-in of integrated circuit (IC) dies at the wafer level. In one embodiment, a wafer is fabricated having an array of dies formed thereon wherein the dies are separated by scribe areas. Surrounding each die is one or more ring conductors which are electrically coupled to various circuits on the die via die bond pads. The wafer further includes a series of conductive pads located in an inactive region of the wafer. Electrically connecting the conductive pads to the ring conductors is a series of redundant scribe conductors. During burn-in, a burn-in indicating apparatus located on each die monitors burn-in parameters such as elapsed burn-in time. The indicating apparatus further records the elapsed burn-in time (or other parameter). The indicating apparatus may be subsequently interrogated to verify the burn-in time.

Abstract: Electrostatic Discharge (ESD) protection scheme includes a divided rail structure to route damaging ESD away from sensitive circuitry. Specifically, Vdd and Vss rails are divided to segregate the ESD current within a circuit, thus isolating the sensitive circuitry from ESD exposure. In an exemplary embodiment, Vdd is divided into Vdd-esd and Vdd core, while Vss is divided into Vss-esd and Vss core. The structure in cooperation with diodes, clamps and resistors enables to isolate the rails (Vdd core and Vss core) associated with sensitive circuitry from ESD current.

Abstract: Electrostatic Discharge (ESD) protection scheme includes a divided rail structure to route damaging ESD away from sensitive circuitry. Specifically, Vdd and Vss rails are divided to segregate the ESD current within a circuit, thus isolating the sensitive circuitry from ESD exposure. In an exemplary embodiment, Vdd is divided into Vdd-esd and Vdd core, while Vss is divided into Vss-esd and Vss core. The structure in cooperation with diodes, clamps and resistors enables to isolate the rails (Vdd core and Vss core) associated with sensitive circuitry from ESD current.