Patents by Inventor James Todd Dickey

James Todd Dickey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High density electronic cooling triangular shaped microchannel device
    Patent number: 7523780
    Abstract: An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
    Type: Grant
    Filed: September 19, 2005
    Date of Patent: April 28, 2009
    Assignee: The Aerospace Corporation
    Inventors: James Todd Dickey, Tung Ting Lam
  • High density electronic cooling triangular shaped microchannel device
    Patent number: 6983792
    Abstract: An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: January 10, 2006
    Assignee: The Aerospace Corporation
    Inventors: James Todd Dickey, Tung Ting Lam
  • High density electronic cooling triangular shaped microchannel device
    Publication number: 20040099946
    Abstract: An isosceles triangular cross section shaped microchannel-cooling device conducts a working fluid for the removal of heat from a heat source. The triangular shaped microchannel provides an increased thermal transport coefficient for improved heat transport with an improved mass flow rate. The microchannel-cooling device is well suited for removing heat from electronics, semiconductor components, and systems.
    Type: Application
    Filed: November 27, 2002
    Publication date: May 27, 2004
    Inventors: James Todd Dickey, Tung Ting Lam
  • Microelectronic substrate active thermal cooling wick
    Patent number: 6070656
    Abstract: A dynamic microelectronic cooling wick is displaced from and juxtaposed to a heated substrate for creating a capillary wick providing dynamic capillary pumping action of a cooling fluid for temperature regulation of the substrate. The wick consists of at least two materials having different coefficients of thermal expansion so that the wick flexes in the presence of changing temperature to thereby change the effective radius of the capillary wick to transport the fluid to a substrate hot spot.
    Type: Grant
    Filed: December 9, 1998
    Date of Patent: June 6, 2000
    Assignee: The Aerospace Corporation
    Inventor: James Todd Dickey