Patents by Inventor James V. Ball

James V. Ball has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Remote computer input system which detects point source on operator
    Patent number: 5686942
    Abstract: A computer input system for input of data to a computer from a remote location by a human operator. The computer input system includes a detecting means which remotely detects the movement of a point object, such as an operator's nose, and a processing means for converting the detected motion into an output signal. The output signal may be used by a computer to move an image within a picture on a display. The detecting means detects the motion of the point object by detecting a ray which is reflected from or radiated by the point object.
    Type: Grant
    Filed: December 1, 1994
    Date of Patent: November 11, 1997
    Assignee: National Semiconductor Corporation
    Inventor: James V. Ball
  • Apparatus for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
    Patent number: 5583373
    Abstract: A preferred embodiment of an integrated semiconductor device includes a semiconductor die having a hole therethrough. A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend the paddle member in the hole. A cap layer is bonded to the semiconductor die to completely cover the hole, the paddle member, and the handle member. The second surface of the semiconductor die is bonded to the lead frame.
    Type: Grant
    Filed: October 12, 1995
    Date of Patent: December 10, 1996
    Assignee: National Semiconductor Corporation
    Inventors: James V. Ball, Robert A. Pease
  • Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
    Patent number: 5508231
    Abstract: A preferred embodiment of an integrated semiconductor device includes a semiconductor die having a hole therethrough. A paddle member includes a handle member connected between the paddle member and the semiconductor die to suspend the paddle member in the hole. A cap layer is bonded to the semiconductor die to completely cover the hole, the paddle member, and the handle member. The second surface of the semiconductor die is bonded to the lead frame.
    Type: Grant
    Filed: October 13, 1994
    Date of Patent: April 16, 1996
    Assignee: National Semiconductor Corporation
    Inventors: James V. Ball, Robert A. Pease