Abstract: A computerized system for transacting the purchase and sale of consumer motor fuels between motor fuel merchants and retail consumers through software on a mobile or desktop connected device for periods in the future through the simultaneous execution of multi-party, multi-layered contingent transactions and pricing algorithms to ensure that all inter-related motor fuel merchant transactions are simultaneously transacted upon a retail consumer purchase execution. Motor fuels include refined products such as gasoline and diesel fuel, renewable fuels (e.g. ethanol, biodiesel), natural gas (including liquefied natural gas), jet fuel and electricity.

Abstract: A vaporizer device includes various modular components. The vaporizer device includes a first subassembly. The first subassembly includes a cartridge connector that secures a vaporizer cartridge to the vaporizer device and includes at least two receptacle contacts that electrically communicate with the vaporizer cartridge. The vaporizer device includes a second subassembly. The second subassembly includes a skeleton defining a rigid tray that retains at least a power source. The vaporizer device also includes a third subassembly. The third subassembly includes a plurality of charging contacts that supply power to the power source, and an end cap that encloses an end of the vaporizer device.

Abstract: A computerized system for transacting the purchase and sale of consumer motor fuels between motor fuel merchants and retail consumers through software on a mobile or desktop connected device for periods in the future through the simultaneous execution of multi-party, multi-layered contingent transactions and pricing algorithms to ensure that all inter-related motor fuel merchant transactions are simultaneously transacted upon a retail consumer purchase execution. Motor fuels include refined products such as gasoline and diesel fuel, renewable fuels (e.g. ethanol, biodiesel), natural gas (including liquefied natural gas), jet fuel and electricity.

Abstract: An apparatus for use with eyewear and a hearing aid, comprises a sleeve having a first open end, a second open end and a first length of an elastomeric material between the first open end and the second open end, the length of the material being commensurate with a second length of the housing of the hearing aid; the sleeve sized and configured to receive the housing of the hearing aid through one of the first open end and the second open end and the at least one temple of the eyewear. The eyewear is of the type that has a lens frame and at least one temple connected to the lens. The hearing aid is of the type that has an earphone connected to a housing for enclosing circuitry for powering the earphone and for processing electrical signals from the earphone.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes a socket terminal having a first end, and a second end opposed to the first end. An axial hole extends inward from the second end, and an electrically conductive core member is disposed within the axial hole. The core member is formed of a different material than the socket terminal body, and is sized and shaped to obstruct the hole. In addition, the first end of the socket terminal is configured to receive a pin terminal, and the second end of the socket terminal is configured to be received within a hole in a printed circuit board.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract: An intercoupling component is provided which permits reliable, non-permanent electrical connection between a first substrate and a second substrate. The intercoupling component includes an electrically conductive terminal including a first end and a second end opposed to the first end. The first and second ends are configured to receive a solder ball. An axial hole extends inward from the first end of the terminal, and an electrically conductive core member is disposed within the hole. The core member is sized and shaped to obstruct the hole. In addition, at least an outer surface of the core member includes a first material and at least an outer surface of the body includes a second material, the first material having greater solderability than the second material.

Abstract: An intercoupling component includes first male contacts, each first male contact received within a corresponding aperture of a first array of apertures and extending beyond a second surface of a first insulative support member toward a second insulative support member, each first male contact having a first axis; second contacts, each second contact received within a corresponding aperture of a second array of apertures, each second contact having a second axis; and an alignment member configured to establish a specified position of the first insulative support member relative to the second insulative support member. The first axis of each male contact is offset from the second axis of a corresponding second contact when the first insulative support member is in the specified position relative to the second insulative support member.

Abstract: An intercoupling component includes first male contacts, each first male contact received within a corresponding aperture of a first array of apertures and extending beyond a second surface of a first insulative support member toward a second insulative support member, each first male contact having a first axis; second contacts, each second contact received within a corresponding aperture of a second array of apertures, each second contact having a second axis; and an alignment member configured to establish a specified position of the first insulative support member relative to the second insulative support member. The first axis of each male contact is offset from the second axis of a corresponding second contact when the first insulative support member is in the specified position relative to the second insulative support member.

Abstract: A hermaphroditic terminal assembly for connecting electrical devices includes an insulating support member for supporting female sockets and male pins, a number of female sockets, and a number of male pins. An intercoupling component for connecting electrical devices includes two hermaphroditic terminal assemblies configured such that the first hermaphroditic terminal assembly can be mated with the second hermaphroditic terminal assembly.

Abstract: A hermaphroditic terminal assembly for connecting electrical devices includes an insulating support member for supporting female sockets and male pins, a number of female sockets, and a number of male pins. An intercoupling component for connecting electrical devices includes two hermaphroditic terminal assemblies configured such that the first hermaphroditic terminal assembly can be mated with the second hermaphroditic terminal assembly.

Abstract: A socket terminal assembly includes a socket body having a first end with a first opening to receive a contact element and a second opening at a second end to receive a pin. A contact element, located in the first opening, is configured to contact the corresponding connection region of a printed circuit board; a pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. A contact spring in the second opening receives the pin and applies a frictional force sufficient to retain the lower end of the pin within the opening of the socket body. A resilient member is disposed within the opening between the contact element and the contact spring. The resilient member applies to the pin and contact element, in response to a downward force applied to the pin or an upward force applied to the contact element, a force sufficient to overcome the frictional force of the contact spring.

Abstract: A socket assembly includes an electrically insulative socket body having holes extending through the socket body and arranged in a predetermined footprint corresponding to the array of electrical connection regions of the integrated circuit package, and a first and a second plurality of electrically conductive terminals. Each of the plurality of electrically conductive terminals are disposed in a corresponding one of a group of holes in the socket body. The first and second plurality of conductive terminals have an outer surface with a first and a second retaining member formed thereon, respectively, to retain the electrically conductive terminals within a corresponding one of the holes. The first retaining member is positioned a first axial distance from an end of the first plurality of terminal pins and the second retaining member is positioned a second axial distance from an end of the first plurality of terminal pins, the second axial distance being different than the first axial distance.

Abstract: A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

Abstract: An intercoupling component (e.g., socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array positioned within the intercoupling component, while maintaining a relatively low profile. The intercoupling component includes a heat sink positioned within the package support member configured to contact both a lower surface of the integrated circuit package disposed within the package support member and a substrate such as a printed circuit board. The package support member includes contact terminals disposed within associated openings of the package for electrically connecting the contacting areas of the integrated circuit package to the corresponding connection regions of the substrate. The openings extend from an upper surface to an opposite lower surface of the support member and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink may be configured to be removable and replaceable.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

Abstract: A socket terminal assembly includes a socket body having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board, a contact spring, disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin within the opening of the socket body; and a resilient member, disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end adapted to contact an electrical contacting area of an integrated circuit package and an opposite end configured to be inserted within the opening of the socket body. An intercoupling component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

Abstract: A method of providing such an intercoupling component includes positioning terminals within holes of an insulative support member and attaching a solder ball to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contacts a corresponding solder ball; soldering the solder ball to the end of the terminal while maintaining the generally spherical shape of the solder ball; and removing the insulative support member from the fixture. The solder balls are generally soldered by passing the insulative support member with terminals and fixture with solder balls through a reflow apparatus.