Abstract: Semiconductor devices having redistribution structures, and associated systems and methods, are disclosed herein. In some embodiments, a semiconductor assembly comprises a die stack including a plurality of semiconductor dies, and a routing substrate mounted on the die stack. The routing substrate includes an upper surface having a redistribution structure. The semiconductor assembly also includes a plurality of electrical connectors coupling the redistribution structure to at least some of the semiconductor dies. The semiconductor assembly further includes a controller die mounted on the routing substrate. The controller die includes an active surface that faces the upper surface of the routing substrate and is electrically coupled to the redistribution structure, such that the routing substrate and the semiconductor dies are electrically coupled to the controller die via the redistribution structure.

Abstract: An authentication management platform that enables authentication systems from various vendors to be integrated into a single service offering. The disclosed arrangement can support multiple, distinct customers and multiple primary authentication servers on a single platform. The management platform provides access only to users that enter a valid passcode comprising both: (1) a personal identification number (PIN) and (2) the current code generated by a security token card assigned to that user. The authentication management platform may be configured to be controlled and maintained by the subscriber to the system, or may be serviced/maintained by a third party service provider.