Patents by Inventor James W. Liporace

James W. Liporace has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrostatic chuck with diamond coating
    Patent number: 5166856
    Abstract: An electrostatic chuck includes a body of refractory metal, preferably molybdenum, sized to support a semiconductor wafer. A first layer of diamond having a thickness in the range of 0.1-5.0 microns coats the refractory metal body. A pair of generally planar electrodes, preferably formed by molybdenum, are disposed on the first layer of diamond. A second layer of diamond, of like thickness as the first layer, conformally coats the pair of electrodes. A dc voltage applied across the pair of electrodes develops an electrostatic force to hold the wafer against the second diamond layer.
    Type: Grant
    Filed: January 31, 1991
    Date of Patent: November 24, 1992
    Assignee: International Business Machines Corporation
    Inventors: James W. Liporace, James A. Seirmarco