Patents by Inventor James Willard Hannah

James Willard Hannah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry for mechanical polishing (CMP) of metals and use thereof
    Patent number: 6812193
    Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.
    Type: Grant
    Filed: August 30, 2002
    Date of Patent: November 2, 2004
    Assignee: International Business Machines Corporation
    Inventors: Michael Todd Brigham, Donald Francis Canaperi, Michael Addison Cobb, William Cote, Kenneth Morgan Davis, Scott Alan Estes, Edward Jack Gordon, James Willard Hannah, Mahadevaiyer Krishnan, Michael Francis Lofaro, Michael Joseph MacDonald, Dean Allen Schaffer, George James Slusser, James Anthony Tornello, Eric Jeffrey White
  • Slurry for mechanical polishing (CMP) of metals and use thereof
    Publication number: 20030073593
    Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.
    Type: Application
    Filed: August 30, 2002
    Publication date: April 17, 2003
    Inventors: Michael Todd Brigham, Donald Francis Canaperi, Michael A. Cobb, William Cote, Kenneth M. Davis, Scott Alan Estes, Edward Jack Gordon, James Willard Hannah, Mahadevaiyer Krishnan, Michael F. Lofaro, Michael Joseph MacDonald, Dean Allen Schaffer, George James Slusser, James A. Tornello, Eric Jeffrey White
  • Method of drying substrates
    Patent number: 6508014
    Abstract: A method of removing water from the surface of a silicon wafer or other substrate subjected to wet processing which includes a step of water rinsing. In this method a silicon wafer whose surface includes liquid water is disposed in an atmosphere saturated with water vapor. The water vapor is removed from the surface of the silicon wafer by a stream of water-saturated gas. Upon removal of liquid water from the surface of the silicon wafer the water vapor in the water vapor saturated atmosphere is removed by evaporation.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: January 21, 2003
    Assignee: International Business Machines Corporation
    Inventors: Russell H. Arndt, Glenn Walton Gale, James Willard Hannah, Kenneth T. Settlemyer, Jr.
  • Method of drying substrates
    Publication number: 20020112369
    Abstract: A method of removing water from the surface of a silicon wafer or other substrate subjected to wet processing which includes a step of water rinsing. In this method a silicon wafer whose surface includes liquid water is disposed in an atmosphere saturated with water vapor. The water vapor is removed from the surface of the silicon wafer by a stream of water-saturated gas. Upon removal of liquid water from the surface of the silicon wafer the water vapor in the water vapor saturated atmosphere is removed by evaporation.
    Type: Application
    Filed: February 16, 2001
    Publication date: August 22, 2002
    Applicant: International Business Machines Corporation
    Inventors: Russell H. Arndt, Glenn Walton Gale, James Willard Hannah, Kenneth T. Settlemyer