Abstract: A digital image capture system includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connections between the image sensor and a circuit board. The package structure includes attachment features that enable an optics system to be securely attached to the package structure after the package structure has been soldered to the circuit board In an embodiment, the attachment features align the optics system with the image sensor without having to power up the image sensor. An embodiment of the attachment features includes mechanical attachment features, such as clip arms and/or clip receivers. In an embodiment, the optics system includes attachment features that are complementary to the attachment features of the package structure. The package structure and optics system may additionally include complementary contact surfaces that create a light-tight connection between the optics system and the package structure.

Abstract: A digital image capture system includes an image sensor package and a powered lens element that is attached to the image sensor package. The image sensor package includes an image sensor, a package structure for holding the image sensor, and electrical connectors for creating electrical connection between the image sensor and a circuit board. The package structure and the powered lens element include complementary surfaces that enable the powered lens element to be attached to the image sensor package. Preferably, the powered lens element is glued to the package structure to create a sealed environment for the image sensor. In an embodiment, a temporary protective cover is attached to the powered lens element to protect the powered lens element during attachment of the image sensor package to the circuit board. In an embodiment of the digital image capture system, an additional powered lens element is attached to the powered lens element to create a composite lens element.

Abstract: Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

Abstract: Packaging for components of an optical module. The packaging includes a flexible circuit coupled to two stiffeners. The packaging has a first sub-assembly with the first stiffener for receiving a first component. The packaging also has a second sub-assembly with the second stiffener for receiving a second component and for coupling to an external circuit. The packaging has a flexible portion with a first end for coupling to the first sub-assembly and a second end for coupling to the second sub-assembly. The flexible portion allows the first sub-assembly to be oriented with respect to the second sub-assembly to form an angle that is greater than zero degrees and less than 180 degrees.

Abstract: An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate.