Abstract: A first structure has alternating fingers of first and second materials, the first material having a higher thermal conductivity than the second material, a second structure has alternating fingers of third and fourth materials, positioned to selectively contact the first structure, and an actuator connected to move the second structure. A method of manufacturing a heat switch includes forming a first structure in a first material having finger separated from each other by gaps, forming a second structure in the first material having fingers at least partially separated from each other by gaps, positioning the first and second structure adjacent to and in contact with each other, and connecting the second structure to an actuator. A method of operating includes receiving an activation signal at an actuator, and using the actuator to move one structure relative to another structure to change alignment between two regions of different thermal conductivity.

Abstract: Various fluidic techniques can employ ducting structures, such as microstructures, that extend between other components, such as plate-like structures. A ducting structure can, for example, include an inlet opening toward or near one plate-like structure, an outlet opening toward or near another plate-like structure, and a duct in which fluid flows after being received through the inlet opening and before being provided through the outlet opening. In some implementations, a ducting structure is photo-defined, such as by exposing a photoimageable structure and then removing either exposed or unexposed regions. In some implementations, a ducting structure is a freestanding polymer microstructure. In some implementations, ducting structures are microstructures that extend approximately the same length between first and second plate-like structures, and have a ratio of length to maximum cavity diameter of approximately two or more.

Abstract: Methods of reducing the intrusions or migrations of photolithography materials by introducing a sol-gel layer onto a porous thin film prior to applying the photolithography/photoresist material layer. Curing the sol-gel layer results in the sol-gel layer merging or unifying with the underlying porous thin film layer so that the combined sol-gel/thin layer exhibits substantially the same properties as the untreated porous thin film layer before the sol-gel was applied. As a result, a greater etching accuracy is achieved.