Abstract: A novel apparatus for bonding of two polished substrates includes a plasma source in a ultra-high vacuum (UHV) chamber and a wafer-guiding element to control and guide wafers in the UHV chamber, where after a plasma activation process the wafers are guided and pressed against each other to form a covalent bond between wafer surfaces. The plasma activation process involves deposition of mono-layer or sub-monolayer metallic atom on the surface of substrates. After deposition of metallic layers, a high-force actuation presses the wafers and forms a covalent bond between the wafers. Then, the bonded wafer pair is ion-sliced or thinned to form single crystalline optical thin film. An annealing process oxidizes the deposited metallic layers and produces optically-transparent single crystalline thin film. An optical waveguide may be fabricated by this thin film while utilizing an electro-optic effect to produce optical modulators and other photonic devices.

Abstract: A novel apparatus for bonding of two polished substrates includes a plasma source in a ultra-high vacuum (UHV) chamber and a wafer-guiding element to control and guide wafers in the UHV chamber, where after a plasma activation process the wafers are guided and pressed against each other to form a covalent bond between wafer surfaces. The plasma activation process involves deposition of mono-layer or sub-monolayer metallic atom on the surface of substrates. After deposition of metallic layers, a high-force actuation presses the wafers and forms a covalent bond between the wafers. Then, the bonded wafer pair is ion-sliced or thinned to form single crystalline optical thin film. An annealing process oxidizes the deposited metallic layers and produces optically-transparent single crystalline thin film. An optical waveguide may be fabricated by this thin film while utilizing an electro-optic effect to produce optical modulators and other photonic devices.

Abstract: A novel apparatus for bonding of two polished substrates includes a plasma source in a ultra-high vacuum (UHV) chamber and a wafer-guiding element to control and guide wafers in the UHV chamber, where after a plasma activation process the wafers are guided and pressed against each other to form a covalent bond between wafer surfaces. The plasma activation process involves deposition of mono-layer or sub-monolayer metallic atom on the surface of substrates. After deposition of metallic layers, a high-force actuation presses the wafers and forms a covalent bond between the wafers. Then, the bonded wafer pair is ion-sliced or thinned to form single crystalline optical thin film. An annealing process oxidizes the deposited metallic layers and produces optically-transparent single crystalline thin film. An optical waveguide may be fabricated by this thin film while utilizing an electro-optic effect to produce optical modulators and other photonic devices.

Abstract: The present disclosure provides methods and systems for bonding multiple wafers. An example system may include a sealable chamber with a first and second substantially vertical post positioned inside of the sealable chamber. The system may also include a first latch connected to the first post via a first pin, wherein the first pin allows the first latch to rotate about the first pin. The system may also include a second latch similarly configured to the first latch. The system may also include a base plate positioned between the first and second posts. The base plate is arranged such that when a first wafer rests on the base plate and a second wafer rests on the first and second latches, moving the base plate from a first position to a second position causes a top surface of the first wafer to contact a bottom surface of the second wafer.

Abstract: An optical disk cassette has a disk eject mechanism that ejects a disk such as a DVD or CD. The disk eject mechanism has pushrod, transfer and kick out portions. The pushrod portion slides relative to a side of the cassette case. Pivotally mounted within the case, the kick out portion pushes a disk to eject it from the case. The transfer portion translates pushrod motion to motion of the kick out portion. In a preferred embodiment, the disk eject mechanism is a unitary body, with pushrod, transfer and kick out portions made homogeneously as a single entity, the pushrod portion being a resilient joining elbow. In another preferred embodiment, the disk eject mechanism has a transfer portion that is a rack and a pinion. The rack extends from the pushrod portion and the pinion is attached to or formed as part of the kick out portion.

Abstract: A system for optical disc storage, writing and reading including a housing holding at least two optical disc racks and a plurality of read/write drives that may be positioned in line with the storage rack. A track spans the racks, (e.g., a parallel track is positioned between two racks). A shuttle mounted on the track allows transfer of discs from the racks to drives. The shuttle may allow for disc pass through, disc rotation, or have other structures for disc transport.

Abstract: A system for optical disc storage, writing and reading including a housing holding at least two optical disc racks and a plurality of read/write drives that may be positioned in line with the storage rack. A track spans the racks, (e.g., a parallel track is positioned between two racks). A shuttle mounted on the track allows transfer of discs from the racks to drives. The shuttle may allow for disc pass through, disc rotation, or have other structures for disc transport.

Abstract: An optical disk cassette has a cassette case with a disk retention device. A free end of the disk retention device acts upon an edge of the optical disk, opposably displacing during insertion and ejection of the optical disk. The device and disk are at equilibrium when the free end is displaced by the full diameter of the disk. When the disk is displaced in the insertion or ejection direction, the free end urges the disk in the insertion or ejection direction, assisting with the optical disk insertion or ejection respectively. Embodiments may have the disk retention device including one or more retainers. Each retainer may have a free end and opposing fixed end, and be flexible or have a flexible region. The free end slides along or otherwise contacts the circumferential edge of the optical disk, exerting a force upon it during optical disk insertion, retention and ejection.

Abstract: An optical disk cassette has a disk eject mechanism that ejects a disk such as a DVD or CD. The disk eject mechanism has pushrod, transfer and kick out portions. The pushrod portion slides relative to a side of the cassette case. Pivotally mounted within the case, the kick out portion pushes a disk to eject it from the case. The transfer portion translates pushrod motion to motion of the kick out portion. In a preferred embodiment, the disk eject mechanism is a unitary body, with pushrod, transfer and kick out portions made homogeneously as a single entity, the pushrod portion being a resilient joining elbow. In another preferred embodiment, the disk eject mechanism has a transfer portion that is a rack and a pinion. The rack extends from the pushrod portion and the pinion is attached to or formed as part of the kick out portion.

Abstract: An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heating elements (112-1, 112-2, 112-3) proximal thereto. The vessel (101) is sized to enclose a volume substantially no larger than necessary to accommodate the carrier (106), and to provide an isothermal process zone (128) extending throughout. In one embodiment, the bottom wall (138) includes a movable pedestal (140) with a bottom heating element therein (112-1), and the pedestal can be lowered and raised to insert the carrier (106) into the vessel (101). The apparatus (100) can include a movable shield (146) that is inserted between the pedestal (140) and the carrier (106) to shield the substrates (108) from the heating element (112-1) and to maintain pedestal temperature.

Abstract: A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.

Abstract: A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.

Abstract: A method and apparatus for providing in-situ monitoring of the removal of materials in localized regions on a semiconductor wafer or substrate during chemical mechanical polishing (CMP) is provided. In particular, the method and apparatus of the present invention provides for detecting the differences in reflectance between the different materials within certain localized regions or zones on the surface of the wafer. The differences in reflectance are used to indicate the rate or progression of material removal in each of the certain localized zones.