Patents by Inventor Jamie Rieg

Jamie Rieg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10356913
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Grant
    Filed: July 26, 2018
    Date of Patent: July 16, 2019
    Assignee: CCL Label, Inc.
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • Publication number: 20180332716
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Application
    Filed: July 26, 2018
    Publication date: November 15, 2018
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • Patent number: 10064289
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: August 28, 2018
    Assignee: CCL Label, Inc.
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • Publication number: 20170311454
    Abstract: The present disclosure related to a flexible electronic substrate assembly and a method and system of processing solder paste onto an electrical substrate. The assembly includes a flexible substrate having a solderable medium provided along the flexible substrate. A pattern of solder paste may be cured to a portion of the solderable medium. The solderable medium may be a generally continuous construction or a patterned construction relative to the flexible substrate. The substrate may be unwound from a roll of substrate material before solder paste is deposited thereon. The flexible electric substrate assembly may be formed though a roll to roll process. Infrared heat may be applied to the substrate with the solder paste deposit as the substrate is traveling along the process direction to reflow the solder paste as the substrate is traveling along the process direction at a high rate of speed.
    Type: Application
    Filed: April 26, 2017
    Publication date: October 26, 2017
    Inventors: Jamie Rieg, Randal Taylor, Willie Fowlkes, John Walsh, Paul Janousek
  • Publication number: 20150180094
    Abstract: A battery assembly includes a battery, an outer layer, and a power indicator apparatus. The battery includes a first terminal and a second terminal. The power indicator apparatus comprises an electrical conductor and a mechanical switch. The electrical conductor is configured to be in continuous electrical communication with the first terminal. The mechanical switch is configured to be actuated by an application of pressure at a single location, and upon actuation, to place the electrical conductor in electrical communication with the second terminal such that the power indicator apparatus can facilitate a reading of a potential energy stored in the battery. Methods of assembly and methods of determining a potential energy stored in the battery are also provided herein.
    Type: Application
    Filed: July 18, 2013
    Publication date: June 25, 2015
    Inventors: Jamie Rieg, Anne Shim, John Walsh, Peikang Liu, Paul Janousek
  • Publication number: 20140370344
    Abstract: A battery includes a first terminal, a second terminal, body connecting the first and second terminals, and an outer layer or label. The label may be provided with a sealant or absorbent feature configured to seal and/or absorb at least a portion of a material leaking from a battery associated with battery assembly label. The label may alternatively comprise a quick response code. The label may alternatively comprise an anti-counterfeiting security feature. The label may alternatively be provided with a designated area that is distinguished from at least one other portion of the battery assembly label and sized and configured to receive markings from a writing utensil.
    Type: Application
    Filed: January 23, 2013
    Publication date: December 18, 2014
    Inventors: Dirk Lovelace, Jamie Rieg, Anne Shim, Paul Janousek