Patents by Inventor Jamil Wakil
Jamil Wakil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200081505Abstract: In an example, a thermal module may include a conductive cover plate, a fan attached to the conductive cover plate, and a flow channel attached to the conductive cover plate downstream from the fan. The flow channel may direct airflow from the fan to an air outlet of the thermal module. The thermal module may be attachable as a single unit to the electronic device.Type: ApplicationFiled: April 21, 2017Publication date: March 12, 2020Inventors: XIANG MA, PAUL R LALINDE, BAOSHENG ZHANG, JAMIL A WAKIL
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Patent number: 9943936Abstract: Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.Type: GrantFiled: October 21, 2014Date of Patent: April 17, 2018Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Michael A. Boraas, Vinod Kamath, Michael S. Miller, Mark E. Steinke, Jamil A. Wakil
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Publication number: 20150033550Abstract: Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.Type: ApplicationFiled: October 21, 2014Publication date: February 5, 2015Inventors: MICHAEL A. BORAAS, VINOD KAMATH, MICHAEL S. MILLER, MARK E. STEINKE, JAMIL A. WAKIL
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Patent number: 8900503Abstract: Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.Type: GrantFiled: September 28, 2011Date of Patent: December 2, 2014Assignee: International Business Machines CorporationInventors: Michael A. Boraas, Vinod Kamath, Michael S. Miller, Mark E. Steinke, Jamil A. Wakil
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Publication number: 20130168068Abstract: A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.Type: ApplicationFiled: December 29, 2011Publication date: July 4, 2013Applicant: International Business Machines CorporationInventors: Zhen Huang, Vinod Kamath, Howard V. Mahaney, JR., Chunjian Ni, Mark E. Steinke, Jamil A. Wakil
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Publication number: 20130074339Abstract: Methods, apparatuses, and computer program products for forming an overmolded dual in-line memory module (DIMM) cooling structure are provided. Embodiments include identifying, by a tagging module, contextual information indicating circumstances in which the photograph was taken; based on the contextual information, selecting, by the tagging module, candidate profiles from a plurality of friend profiles associated with a profile of a user; and suggesting, by the tagging module to the user, the selected candidate profiles as potential friends to tag in the photograph.Type: ApplicationFiled: September 28, 2011Publication date: March 28, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Boraas, Vinod Kamath, Michael S. Miller, Mark E. Steinke, Jamil A. Wakil
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Patent number: 8299608Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.Type: GrantFiled: July 8, 2010Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng
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Publication number: 20120007229Abstract: A die stack package is provided and includes a substrate, a stack of computing components, at least one thermal plate, which is thermally communicative with the stack and a lid supported on the substrate to surround the stack and the at least one thermal plate to thereby define a first heat transfer path extending from one of the computing components to the lid via the at least one thermal plate and a fin coupled to a surface of the lid and the at least one thermal plate, and a second heat transfer path extending from the one of the computing components to the lid surface without passing through the at least one thermal plate.Type: ApplicationFiled: July 8, 2010Publication date: January 12, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gerald K. Bartley, David R. Motschman, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jiantao Zheng
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Patent number: 8037594Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: GrantFiled: May 7, 2008Date of Patent: October 18, 2011Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Patent number: 7982475Abstract: There is provided a method for measuring thermal properties of a semiconductor packaging material. The method includes incorporating at least one conducting feature into a substrate that includes the semiconductor packaging material, applying an electric current to the feature, and measuring a change in temperature of a region of the substrate around the feature as a result of the electric current. There is also provided a test vehicle for measuring thermal properties of a semiconductor packaging material.Type: GrantFiled: February 24, 2006Date of Patent: July 19, 2011Assignee: International Business Machines CorporationInventors: David J Russell, Ronald S Malfatt, Stefano S Oggioni, Jamil A Wakil
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Patent number: 7928562Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: GrantFiled: July 22, 2008Date of Patent: April 19, 2011Assignee: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Patent number: 7698114Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.Type: GrantFiled: November 2, 2005Date of Patent: April 13, 2010Assignee: International Business Machines CorporationInventors: Hendrik F. Hamann, James A. Lacey, Jamil Wakil, Alan J. Weger
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Publication number: 20100019377Abstract: An apparatus to reduce a thermal penalty of a three-dimensional (3D) die stack for use in a computing environment is provided and includes a substrate installed within the computing environment, a first component to perform operations of the computing environment, which is coupled to the substrate in a stacking direction, a set of second components to perform operations of the computing environment, each of which is coupled to the first component and segmented with respect to one another to form a vacated region, a thermal interface material (TIM) disposed on exposed surfaces of the first and second components, and a lid, including a protrusion, coupled to the substrate to overlay the first and second components such that the protrusion extends into the vacated region and such that surfaces of the lid and the protrusion thermally communicate with the first and second components via the TIM.Type: ApplicationFiled: July 22, 2008Publication date: January 28, 2010Applicant: International Business Machines CorporationInventors: Amilcar R. Arvelo, Evan G. Colgan, John H. Magerlein, Kenneth C. Marston, Kathryn C. Rivera, Kamal K. Sikka, Jamil A. Wakil, Xiaojin Wei, Jeffrey A. Zitz
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Publication number: 20090045501Abstract: Chip packages and a related method are disclosed that provide a structure on a side opposite a chip on a carrier of a chip package to substantially match a stiffness of the chip. In one embodiment, a chip package includes a chip coupled to a carrier; and a structure on a side opposite the chip on the carrier, the structure having a first stiffness to substantially match a second stiffness of the chip.Type: ApplicationFiled: August 14, 2007Publication date: February 19, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, David L. Questad, Jamil A. Wakil
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Patent number: 7489512Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: GrantFiled: June 5, 2007Date of Patent: February 10, 2009Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Publication number: 20080303021Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: ApplicationFiled: May 7, 2008Publication date: December 11, 2008Applicant: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Patent number: 7319591Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: GrantFiled: May 26, 2005Date of Patent: January 15, 2008Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Michael A. Gaynes, David L. Questad, Kamal K. Sikka, Hilton T. Toy, Jamil A. Wakil
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Publication number: 20070236890Abstract: Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.Type: ApplicationFiled: June 5, 2007Publication date: October 11, 2007Inventors: Jeffrey Coffin, Michael Gaynes, David Questad, Kamal Sikka, Hilton Toy, Jamil Wakil
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Publication number: 20070202616Abstract: There is provided a method for measuring thermal properties of a semiconductor packaging material. The method includes incorporating at least one conducting feature into a substrate that includes the semiconductor packaging material, applying an electric current to the feature, and measuring a change in temperature of a region of the substrate around the feature as a result of the electric current. There is also provided a test vehicle for measuring thermal properties of a semiconductor packaging material.Type: ApplicationFiled: February 24, 2006Publication date: August 30, 2007Applicant: International Business Machines CorporationInventors: David Russell, Ronald Malfatt, Stefano Oggioni, Jamil Wakil
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Publication number: 20070098037Abstract: Techniques for enhancing thermal design of a system having a number of boundary values are provided. A method for such enhancement includes representing thermal response of the system to the boundary values, obtaining at least one constraining parameter, and determining spatial and/or temporal distribution of the boundary values. The thermal response is represented as a superposition of temperature fields associated with given boundary values. The spatial and/or temporal distribution of the boundary values is determined based on the thermal response represented in the representing step, so as to satisfy the constraining parameter. The boundary values can be, for example, power sources, and the at least one constraining parameter can be, for example, a spatial or temporal location of one of the power sources.Type: ApplicationFiled: November 2, 2005Publication date: May 3, 2007Applicant: International Business Machines CorporationInventors: Hendrik Hamann, James Lacey, Jamil Wakil, Alan Weger