Patents by Inventor Jan Boven

Jan Boven has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a laminated element and the element thus obtained
    Patent number: 4983479
    Abstract: A method of manufacturing a laminated element, in which a substrate 1 is provided with a coating 2 of a liquid-crystalline monomer, in accordance with formula 1, which is oriented by means of an external force, in particular a magnetic field 3, and subsequently subjected to radiation 4, so that a pattern 5 of coating 2 is polymerized and the orientation is fixed, as well as a laminated element, such as an optical component, obtained in accordance with the method.
    Type: Grant
    Filed: February 24, 1989
    Date of Patent: January 8, 1991
    Assignee: U.S. Philips Corporation
    Inventors: Dirk J. Broer, Jan van der Veen, Jan Boven
  • Electroless copper plating solutions
    Patent number: 4171225
    Abstract: Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.
    Type: Grant
    Filed: April 21, 1978
    Date of Patent: October 16, 1979
    Assignee: U.S. Philips Corporation
    Inventors: Arian Molenaar, Henricus M. Van Den Bogaert, Jan Boven