Abstract: A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E-module and stiffness in flexure than hitherto known despite a reduced consumption of material.

Abstract: A chip board including an intermediary layer (1) and a layer (2) of large chips positioned on both sides of said intermediary layer. An outer layer (3) is provided on the 5 outer surface of each layer of large chips. In addition to the chips, the layers include an adhesive. The intermediary layer (1) includes a mixture of wood chips having chip fractions of a chip size of 0.1 to 20 mm, and the chips of this layer are randomly oriented. The individual chip in the layer (2) of large chips presents the following characteristics: a length of approx. 50 to approx. 130 mm, a width of approx. 4 to approx. 40 mm and a thickness of approx. 0.2 to approx. 2.0 mm. The chips within each layer (2) of large chips are all oriented in one and the same direction. As a result, a chip board is obtained which demonstrates a significantly higher E-module and stiffness in flexure than hitherto known despite a reduced consumption of material.

Abstract: A method is disclosed for making an active optical device for coupling to optical fibers. Arrays of contacts are formed on the rear face of a substrate, which is preferably transparent, at precisely defined locations. Components are then flip-chip bonded onto the substrate using a solder alignment technique to attach the components to said substrate in precisely predetermined locations determined by the arrays of contacts. At least one of the components is a light emitter or receiver so that it can be optically coupled through the transparent substrate to an external light guide on the front face of the substrate. Preferably, a guide frame for positioning guide pins is bonded to the substrate also using a solder alignment technique.

Abstract: A method is disclosed for making an active optical device for coupling to optical fibers. Arrays of contacts are formed on the rear face of a substrate, which is preferably transparent, at precisely defined locations. Components are then flip-cup bonded onto the substrate using a solder alignment technique to attach the components to said substrate in precisely predetermined locations determined by the arrays of contacts. At least one of the components is a light emitter or receiver so that it can be optically coupled through the transparent substrate to an external light guide on the front face of the substrate. Preferably, a guide frame for positioning guide pins is bonded to the substrate also using a solder alignment technique.

Abstract: A method is provided for cleaning a combustion exhaust gas containing impurities, such as sulfur oxides and hydrochloric acid, with an additive, such as calcium hydroxide, in a reactor. The combustion gas is passed into a wetting zone where water is injected into the gas. The wet combustion gas is then passed through additive injection zone where the additive is co-currently injected into the combustion gas at a location near the bottom of the injection zone. The additive injection zone is connected to the top of the wetting zone and expands conically outward from the gas discharge outlet of the wetting zone so that as the combustion gas (and additive) travel upward through the additive injection zone the velocity of the combustion gas (and additive) is decreased. The combustion gas and additive are then passed through a cylindrical section having a uniform diameter of a given height and connected to the top of the additive injection zone.

Abstract: An optical module comprising an optoelectronic board having electrical connection sites for connection with an electrical circuit. The module includes a plurality of optoelectronic devices on the optoelectronic board and an optical fiber connector including a plurality of optical elements each for connection with a respective optoelectronic device. Cooperative alignment members on the optoelectronic board and the optical fiber connector are provided for aligning the optoelectronic devices on the board.

Abstract: A system and method for achieving high speed modulation of semi-conductor devices, such as VCSELs, utilizing field effect to confine a signal path is described. In semi-conductor devices operating at high data rates the configuration of connector rails and signal paths can become a limiting factor. Thc present invention provides an arrangement in which the signal return path is confined relative to the energizing signal path by a field effect in a common conductor extending under the signal path.

Abstract: An optical die and method of using same passively mounted to a standard optical housing. The housing provides guide pins received within apertures of the die. The assembly facilitates accurate passive alignment.

Abstract: An adapter for coupling optical and electronic circuits, has a housing including a first portion for mating with an optic fiber termination device, and a second portion for mating with an electronic termination device. At least one electro-optical transducer in the housing has an optical interface for coupling with the optical termination device and an electronic interface for coupling with the electronic termination device. The adapter converts signals between optical and electronic form.

Abstract: An assembly for use in transferring optical signals from an array of surface-emitting lasers to an array of optical fibers. The laser diodes are mounted on a lead frame type structure in an arrangement which corresponds to the position of optical fibers mounted in an optical fiber ferrule. Complementary alignment means in the lead frame and optical fiber ferrule provides proper positioning of the optical fibers in relation to the laser array when assembled.

Abstract: An optical emission device includes a laser source having an emitting surface, and a sensor laterally adjacent the laser source generating an output signal dependent on the amount of light falling on its detection surface. A transparent waveguide is located in front of the emitting surface and extends generally parallel thereto such that light striking the waveguide in a direction normal to the emitting surface passes straight through the waveguide. A coupling medium is placed between the emitting surface and the waveguide. A light dispersant in the coupling medium causes a fraction of the laser light to strike the waveguide at an oblique angle so that it can enter the waveguide and be carried thereby to the sensor. An important advantage of the invention is that is uses inexpensive passive parts. The assembly process easy to implement, and the parts are stable during temperature changes. As a result only a small tracking error occurs.

Abstract: A multiple function, electromagnetically shielded optical module employing flip chip bonded semiconductor lasers. The module positions a series of opto electronic dies on guides provided on an optical source. The dies may be simply stacked upon one another to form a passively aligned module. The shielding substantially reduces electrical cross talk and other sources of electromagnetic interference.

Abstract: An optoelectronic component includes a housing having a first body and a second, spherical body, and an optoelectronic semiconductor element mounted in the second, spherical body. The second, spherical body is adjustably journalled in a cylindrical recess of the first body. The cylindrical recess includes an opening edge and the spherical body includes a portion having substantially the same outer periphery diameter as the diameter of the cylindrical recess at the level with the opening edge of the cylindrical body. A welded joint extends around the whole opening edge to provide a hermetically sealed joint between the opening edge and that portion of the spherical body.

Abstract: An optoelectronic component has an LED (5) and a photodetector (6) mounted on a base (1). A housing has lenses (11, 12) for transmission of emitted/received light. A building block (13) of thin metal plate has a plurality of legs (16, 17) which, when mounting the housing on the base, are squeezed between the housing and the base and provide a mechanical locking of these two units in the desired position in relation to each other. The building element (13) has a bent-down screen portion and/or electrical screening of the semiconductor elements (5, 6) from each other. (FIG.

Abstract: An optoelectronic component has a housing (3) connected to a light guide (7, 8) for transmission of light to/from two optoelectronic semiconductor elements (1, 2) mounted in the housing. Light to a first one of the semiconductor elements (2) is deflected towards this element by a partially transmitting mirror (5). For common adjustment during assembly, the semiconductor element (2) and the mirror (5) are spherically journalled in the housing. The second semiconductor element (1) is rotatably journalled in relation to the mirror (5) and the first semiconductor element (2) for adjustment during assembly.