Abstract: A method of recycling an saturated adsorbent (3) of a filter module (1) of an industrial process plant (15), wherein a first process (17) includes removing the saturated adsorbent (3) from the filter module (1), a fourth process (20) includes washing and reactivating the saturated adsorbent, a fifth process (21) includes drying and packing the reactivated adsorbent in airtight containers, and a seventh process (23) includes replacing the saturated adsorbent by reactivated adsorbent in the filter module (1).

Abstract: A filter system for adsorbing an odor of a gas flow in an industrial process includes a filter module (1) with a layer (11) containing active adsorbent (3). The layer (11) includes a plurality of active adsorbent containing permeable bags (2) arranged in close proximity to each other.

Abstract: A method of recycling an saturated adsorbent (3) of a filter module (1) of an industrial process plant (15), wherein a first process (17) includes removing the saturated adsorbent (3) from the filter module (1), a fourth process (20) includes washing and reactivating the saturated adsorbent, a fifth process (21) includes drying and packing the reactivated adsorbent in airtight containers, and a seventh process (23) includes replacing the saturated adsorbent by reactivated adsorbent in the filter module (1).

Abstract: The present invention provides a method of monitoring the operation of a radiation source fuel droplet stream generator comprising a fuel-containing capillary and a piezo-electric actuator (500). The method comprises analysing the resonance frequency spectrum of a system comprising the fuel-containing capillary and the piezo-electric actuator in particular to look for changes in the resonance frequencies of the acoustic system which may be indicative of a change in the properties of the system requiring investigation.

Abstract: An anti-scatter device for suppressing scattered radiation includes a plurality of x-ray absorbing layers. The anti-scatter device further includes a plurality of spacer layers, such that each spacer layer is arranged between any two of the plurality of x-ray absorbing layers in order to hold each of the x-ray absorbing layers in a pre-defined orientation. Furthermore, each of the spacer layers includes a plurality of unsealed voids to reduce the absorption of x-rays incident on at least a portion of each of the spacer layers.

Abstract: An anti-scatter device for suppressing scattered radiation is disclosed. The anti-scatter device comprises a plurality of x-ray absorbing layers. The anti-scatter device further comprises a plurality of spacer layers, such that each spacer layer is arranged between any two of the plurality of x-ray absorbing layers in order to hold each of the plurality of x-ray absorbing layers in a pre-defined orientation. Furthermore, each of the plurality of spacer layers comprises a plurality of unsealed voids to reduce the absorption of x-rays incident on at least a portion on each of the spacer layers.

Abstract: A method and system for the processing of one or more wafers in a process tool is provided, the method comprising subjecting the one or more wafer in a reaction chamber to a process, generating an inhibit next load flag on predefined conditions, the inhibit next load flag not effecting already started processing of a wafer. Prior to the start of the processing of a wafer, a check is performed to see if an inhibit next load flag has been set. When upon checking it has been found that an inhibit next load has been set, the start of the process in the reaction chamber is prohibited. The method further includes providing pre-programmed recovery procedures, such that after execution of a pre-programmed recovery procedure the to be processed wafer of which the start of the processing is prohibited ends in a defined state such that the tool can be used for further processing.

Abstract: A method and system for the processing of one or more wafers in a process tool is provided, the method comprising subjecting the one or more wafer in a reaction chamber to a process, generating an inhibit next load flag on predefined conditions, the inhibit next load flag not effecting already started processing of a wafer. Prior to the start of the processing of a wafer, a check is performed to see if an inhibit next load flag has been set. When upon checking it has been found that an inhibit next load has been set, the start of the process in the reaction chamber is prohibited. The method further includes providing pre-programmed recovery procedures, such that after execution of a pre-programmed recovery procedure the to be processed wafer of which the start of the processing is prohibited ends in a defined state such that the tool can be used for further processing.

Abstract: The method consists in the fact that from at least one external source (3) electromagnetic energy is conducted to at least one hollow electrode (1) with elements (14) locally increasing the density of electromagnetic energy, by which, inside the cavities of the electrode (1) and/or at its orifice and in the external environment an intensive discharge is generated.