Patents by Inventor Jan Rayman, JR.

Jan Rayman, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11718995
    Abstract: Disclosed herein is a method of manufacturing an improved cover board product with a panel. In some embodiments, the method includes preparing fragments into an assembly; mixing the fragments and an adhesive into a blended core furnish; applying the adhesive to a top side of a bottom layer fabric in the assembly; forming a core mat of the blended core furnish on top of the adhesive; applying the adhesive to a top side of the core mat; applying a surface layer fabric on the top side of the adhesive; pressing the assembly; and cutting and trimming the assembly to form panels.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: August 8, 2023
    Assignee: Continuus Materials Intellectual Property, LLC
    Inventors: Jan Rayman, Jr., Matthew Spencer, Marko Suput, Dean DeRaad, Marc Lower, Jack G. Winterowd
  • Publication number: 20210238855
    Abstract: Disclosed herein is a method of manufacturing an improved cover board product with a panel. In some embodiments, the method includes preparing fragments into an assembly; mixing the fragments and an adhesive into a blended core furnish; applying the adhesive to a top side of a bottom layer fabric in the assembly; forming a core mat of the blended core furnish on top of the adhesive; applying the adhesive to a top side of the core mat; applying a surface layer fabric on the top side of the adhesive; pressing the assembly; and cutting and trimming the assembly to form panels.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Applicant: Continuus Materials Intellectual Property, LLC
    Inventors: Jan Rayman, Jr., Matthew Spencer, Marko Suput, Dean DeRaad, Marc Lower, Jack G. Winterowd
  • Patent number: 11060290
    Abstract: An improved cover board product with a panel comprised of three discrete layers: a top surface layer comprised of either paper or a fiberglass web, a bottom surface layer comprised of either paper or a fiberglass web, and a core layer comprised of discrete paper fragments and polypropylene fragments, which are connected by use of a thermoplastic bonding resin, including polyethylene. The bonding resin is generally attached in a random pattern to less than 100% of the paper fragment and polypropylene fragment surface area. The paper fragments are generally shaped as irregular plates. The polypropylene fragments can have multiple shape types. The two different fragment types are randomly distributed in the core layer relative to each other. The core layer includes small voids in and around the particles, which improves flexibility. The core layer is attached to the top and bottom surface layers by use of a thermoplastic adhesive, including polyethylene.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: July 13, 2021
    Assignee: Continuus Materials Intellectual Property, LLC
    Inventors: Jan Rayman, Jr., Matthew Spencer, Marko Suput, Dean DeRaad, Marc Lower, Jack G. Winterowd
  • Publication number: 20210189732
    Abstract: An improved cover board product with a panel comprised of three discrete layers: a top surface layer comprised of either paper or a fiberglass web, a bottom surface layer comprised of either paper or a fiberglass web, and a core layer comprised of discrete paper fragments and polypropylene fragments, which are connected by use of a thermoplastic bonding resin, including polyethylene. The bonding resin is generally attached in a random pattern to less than 100% of the paper fragment and polypropylene fragment surface area. The paper fragments are generally shaped as irregular plates. The polypropylene fragments can have multiple shape types. The two different fragment types are randomly distributed in the core layer relative to each other. The core layer includes small voids in and around the particles, which improves flexibility. The core layer is attached to the top and bottom surface layers by use of a thermoplastic adhesive, including polyethylene.
    Type: Application
    Filed: October 13, 2020
    Publication date: June 24, 2021
    Applicant: Continuus Materials Intellectual Property, LLC
    Inventors: Jan Rayman, JR., Matthew Spencer, Marko Suput, Dean DeRaad, Marc Lower, Jack G. Winterowd