Abstract: A method for ink jet printing of a substrate, as well as an ink jet printed layer. To provide a method for ink jet printing of a substrate that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate is supplied, which is then coated with a layer of a print medium on at least one surface. A labeling of the substrate is carried out by applying the same print medium to result in a different color shade of the printed layer.

Abstract: A method for producing a labeled printed circuit board, as well as a labeled electric printed circuit board. In order to provide a method for producing a labeled printed circuit board that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate with conductor tracks is supplied, which is then coated with a functional lacquer layer on at least one surface. A labeling of the substrate in different color shades of the functional lacquer layer is also carried out.

Abstract: The object of the invention, which relates to a method for printing a substrate by means of inkjet printing, is to enable precise printing of a landing point matrix, which is displaced, rotated, or distorted, particularly not linearly distorted, as compared to an ideally orthogonal landing point matrix, with less complexity. Said object is achieved in that the lateral resolution is selected to be large enough that the smallest distance between nozzle lines is less than the minimum distance between the landing zone rows, and that, with a variation, specified by the substrate, of the distance of adjacent landing zone rows between various landing zone lines (distortion), the position of the landing zones of a landing zone line is determined relative to the nozzle lines and consequently only the printhead nozzles having a nozzle line intersecting a landing zone are actuated according to a nozzle actuation scheme and the corresponding landing zone type.

Abstract: The invention relates to a method for producing a labeled printed circuit board, as well as a labeled electric printed circuit board. In order to provide a method for producing a labeled printed circuit board that is particularly fast and energy-conserving and does not require any systems with high procurement and operating costs, initially a substrate with conductor tracks is supplied which is then coated with a functional lacquer layer on at least one surface, wherein a labeling of the substrate in different color shades of the functional lacquer layer is also carried out.

Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.

Abstract: The object of the invention, which relates to a method for printing a substrate by means of inkjet printing, is to enable precise printing of a landing point matrix, which is displaced, rotated, or distorted, particularly not linearly distorted, as compared to an ideally orthogonal landing point matrix, with less complexity. Said object is achieved in that the lateral resolution is selected to be large enough that the smallest distance between nozzle lines is less than the minimum distance between the landing zone rows, and that, with a variation, specified by the substrate, of the distance of adjacent landing zone rows between various landing zone lines (distortion), the position of the landing zones of a landing zone line is determined relative to the nozzle lines and consequently only the printhead nozzles having a nozzle line intersecting a landing zone are actuated according to a nozzle actuation scheme and the corresponding landing zone type.

Abstract: The invention relates to a holding device for holding substrates such as printed circuit boards, metal sheets, foils or the like, comprising a suction surface, the suction surface having a plurality of suction nozzles and the suction nozzles being subjected to a negative pressure relative to the ambient pressure by means of a device providing negative pressure for providing a holding force for one or more substrates, wherein the device providing negative pressure provides negative pressure, such that the ratio of the cumulated drop in pressure of all suction nozzles to the cumulated drop in pressure of all suction nozzles and supply lines of the suction nozzles up to the device providing negative pressure is greater than 0.25%, in particular greater than 1%, preferably greater than 25%, in particular greater than 35%, preferably greater than 40%.

Abstract: The invention relates to a surface machining device comprising a substrate support for receiving a substrate to be machined, a machining unit which can be moved relative to the substrate support along a first and a second movement axis, a position detecting unit for ascertaining the orientation of the substrate, and a control unit for controlling the movement of the machining unit dependent on the orientation of the substrate on the substrate support. The aim of the invention is to provide a surface machining device which can be produced in a compact manner and which allows a precise machining of the surface of the substrate to be machined in an inexpensive manner regardless of the position of the substrate on the substrate support. This is achieved in that the machining unit can be pivoted relative to the substrate support, in particular about a height axis which extends perpendicularly to the plane formed by the first and second movement axis.