Abstract: Metallized polymer compositions are disclosed, the surface of which comprises an intermetallic compound of a metal element A (Sn, As, Sb or Bi) and a metal element B (Fe, Co, Ni, Cu, Zn, Ga, Ru, Rh, Pd, Ag, Cd or In), preferably an intermetallic compound of antimony and a metal element B. Processes for producing such metallized polymer compositions involve either the reduction of a metal element A compound in the presence of metallic metal element B and the polymer or the compression of a laminate of metal element A and metal element B layers onto the polymer. The metallized polymers are useful in the production of printing circuit boards, electromagnetic interference shielding devices, membrane switches, capacitors, conductive fibers, magnetic tapes and disc, antistatic mats, barrier polymers and optical storage devices.

Abstract: The invention relates to an apparatus for the transfer of heat by means of hollow filaments which extend in the form of a helix and/or a spiral and are provided in more than two layers. The apparatus may be made up of a multilayer winding. The outer diameter of the hollow filaments is preferably 0.05-1 mm and the wall thickness is 5-20% of the outer diameter. The invention also relates to the use of this heat exchanger in various heating systems.