Patents by Inventor Janet Feng

Janet Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages
    Publication number: 20110156283
    Abstract: A microelectronic package comprises a die (110) having a front side (111) containing active circuitry (115) and a back side (112) opposite the front side and a film (120) on the back side of the die. The film has a thickness (121) of at least 20 micrometers, a Young's modulus of at least 10 GPa, and a post-cure glass transition temperature of at least 100° Celsius.
    Type: Application
    Filed: December 28, 2009
    Publication date: June 30, 2011
    Inventors: Shankar Ganapathysubramanian, Leonel R. Arana, Robert L. Sankman, Wen Janet Feng, Robert M. Nickerson
  • Microelectronic package with wear resistant coating
    Patent number: 7759780
    Abstract: A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: July 20, 2010
    Assignee: Intel Corporation
    Inventors: Nirupama Chakrapani, Vijay S Wakharkar, Janet Feng, Nisha Ananthakrishnan, Shankar Ganapathysubramanian, Gregory S Constable
  • MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING
    Publication number: 20100078806
    Abstract: A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
    Type: Application
    Filed: September 30, 2008
    Publication date: April 1, 2010
    Inventors: Nirupama Chakrapani, Vijay S. Wakharkar, Janet Feng, Nisha Ananthakrishnan, Shankar Ganapathysubranian, Gregory S. Constable