Patents by Inventor Jang Seok Lee

Jang Seok Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010013408
    Abstract: Disclosed an integrated refrigerator evaporator having a plurality of pipes and fins which is manufactured by injection molding with plastics. According to the present invention, pipes and fins are molded by means of at least one plastic plates, and a heat exchanger is formed by molding the pipes and fins in a series of “S” shape. A first bending section formed by the heat exchanger, which is molded in a series of “S” shape, is inserted into a mold main body to manufacture a header cap. A first header cap is manufactured by injecting melted plastic material body into the mold main body under the state of covering a mold cap. The first header cap is engaged with a first header main body comprising the first header cap and the refrigerant inlet and outlet. The refrigerator evaporator according to the present invention results in a relatively lower product cost than the evaporator composed of a metal substance as well as a high recyclability.
    Type: Application
    Filed: December 4, 2000
    Publication date: August 16, 2001
    Inventors: Tae Hee Lee, Jang Seok Lee, Sang Wook Lee, Se Yoon Oh
  • Patent number: 6230511
    Abstract: Evaporator in a refrigerator, is disclosed, which has the refrigerant tube, cooling fins and the defrosting tube formed as one unit for simple structure and a better heat exchange efficiency, the evaporator including one pair of refrigerant tubes for flow of refrigerant therethrough, a defrosting tube disposed between the two refrigerant tubes, cooling fins formed as one unit with, and connecting the refrigerant tubes and the defrosting tube, turbulence forming means adapted to form a turbulence of air in a process of flowing around the evaporator for improving the heat exchange efficiency, internal heat conduction area enlarging means adapted to enlarge an internal area of the refrigerant tubes for improving the heat exchange efficiency, and external heat conduction area enlarging means adapted to enlarge an external area of the refrigerant tubes for improving the heat exchange efficiency.
    Type: Grant
    Filed: August 25, 1998
    Date of Patent: May 15, 2001
    Assignee: LG Electronics, Inc.
    Inventors: Jang Seok Lee, Jong Jin Park, Tae Hee Lee, Byung Jo Kim, Sang Wook Lee, Jeom Yul Yun, Bong Soo Hwang, Jong Jin Kim, Dong Won Kim, Gyong Hwan Kweon, Tae Hyun Kim