Abstract: The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.

Abstract: An image reading apparatus includes an image sensor, a document feeder, and a processor. The document feeder includes a first driving device, a second driving device, a third driving device, a first sensor, and a second sensor. The first driving device includes a pick-up member to move documents from a tray to a document conveying path using a driving force through a first clutch. The second driving device is to move the tray with the documents to a side of the pick-up member using a driving force through a second clutch. The third driving device to move the documents along the document conveying path onto the image sensor using the driving force of the motor. The first and second sensors detect the documents on the document conveying path. The processor controls an operation of the first clutch based on the signals of the first and second sensors.

Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.

Abstract: An aerosol generation device and a control method thereof are provided. The aerosol generation device according to some embodiments of the present disclosure may include a liquid supply part configured to supply a liquid aerosol-forming substrate, a vaporization element configured to vaporize the supplied liquid aerosol-forming substrate to generate an aerosol in a vaporization space, and an airflow path configured to allow the aerosol generated in the vaporization space to move toward a mouthpiece. Here, the vaporization element, an inlet of the airflow path, and an outlet of the airflow path may be formed in a nonlinear structure, and accordingly, a droplet discharge phenomenon and an airflow path blockage phenomenon may be prevented.

Abstract: Through a combination of a multi-stage adhesive layer structure, a compressed region structure, and a barrier layer, the polishing pad according to the present disclosure can minimize the leakage of liquid components flowing through the interface between the window and the polishing pad and realize excellent long-term durability without leakage even when substantially applied to a polishing process for a long time. In the method for manufacturing a semiconductor device, the specific structure having the window of the polishing pad applied thereto as described above is combined with the optimal process conditions related to the polishing process so that the process efficiency can be further improved, and excellent quality can be secured in terms of polishing rate, polishing flatness, defect prevention, and the like.

Abstract: An aerosol generation device with improved heating efficiency is provided. The aerosol generation device according to some embodiments of the present disclosure includes a case in which an insertion hole is formed to receive an aerosol-generating article, a heater configured to heat the aerosol-generating article inserted through the insertion hole to generate an aerosol, and an adapter disposed between the insertion hole and the heater. The adapter may allow a medium portion of the inserted aerosol-generating article to be deformed to a desired pressed shape so that the heating efficiency of the heater is improved.

Abstract: A laser-based aerosol generation device and a heating method thereof are provided. The aerosol generation device according to some embodiments of the present disclosure may include a laser radiation part configured to heat an aerosol-generating article to generate an aerosol by radiating laser to aerosol-generating article. By instantaneously heating a local surface of the aerosol-generating article, the laser heating method may ensure immediate aerosol generation without a preheating time.

Abstract: An organic hole transport material according to an embodiment of the present disclosure is an organic hole transport material doped with an acid-base adduct, in which the acid-base adduct is formed by an acid-base reaction involving an acid and a base, and the acid contains hydrogen ions (H+) and has the formula H+X?, where H+ corresponds to a hydrogen ion, and X? corresponds to an anion and corresponds to TFSI?.

Abstract: A heater for aerosol generation devices and an aerosol generation device including the same are provided. The heater according to some embodiments of the present disclosure may include a first electroconductive pattern which is configured to perform a heating function and a second electroconductive pattern which is made of a material with a temperature coefficient of resistance higher than that of the first electroconductive pattern and is configured to perform a temperature measurement function for the heater. In this case, since a temperature of a heating surface of the heater may be accurately measured through the second electroconductive pattern, control precision for the heater may be improved.

Abstract: This invention relates to a polishing pad and a method for manufacturing the same. The polishing pad may include a top pad layer and a window block. The top pad layer may include a groove pattern formed on an upper surface of the top pad layer. A first hole may be formed through the top pad layer. The window block may be inserted into the first hole. The top pad layer and the window block may have a structure coincided with following Formula 1. 1.1 ? Gap + Thk RTPC Thk grv ? 3. Formula ? 1 In Formula 1, the gap may indicate a height difference between an upper surface of the top pad layer and an upper surface of the window block, the ThkRTPC may indicate a thickness of the window block, and the Thkgrv may indicate a depth of the groove pattern.

Abstract: Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization and a process for preparing the same. It is possible to control the size and distribution of pores in the porous polyurethane polishing pad by using thermally expanded microcapsules and an inert gas as a gas phase foaming agent, whereby the polishing performance thereof can be adjusted.

Abstract: A polishing pad includes a polyurethane, wherein the polyurethane includes a fluorinated repeating unit represented by Formula 1, wherein the number of defects on a substrate after polishing with the polishing pad and a fumed silica slurry is 40 or less; wherein R11 and R12 are each independently selected from the group consisting of hydrogen, C1-C10 alkyl groups, and fluorine, with the proviso that at least one of R11 and R12 is fluorine, L is a C1-C5 alkylene group or —O—, R13 and R14 are each independently selected from the group consisting of hydrogen, C1-C10 alkyl groups, and fluorine, with the proviso that at least one of R13 and R14 is fluorine, and n and m are each independently an integer from 0 to 20, with the proviso that n and m are not simultaneously 0.

Abstract: The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, the polishing pad includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface, and wherein the polishing constant layer includes a cured product of a composition having thermosetting polyurethane particles and a binder.

Abstract: The present disclosure is to provide a polishing pad which is capable of providing physical properties corresponding to various polishing purposes for various polishing objects through the subdivided structural design in a thickness direction, and of securing environmental friendliness by applying a recycled or recyclable material to at least some components, in relation to disposal after use, unlike the conventional polishing pad. Specifically, it includes a polishing layer, wherein the polishing layer includes a polishing variable layer having a polishing surface; and a polishing constant layer disposed on a rear surface side of the polishing variable layer opposite to the polishing surface.

Abstract: Provided herein are an induction heating-type aerosol-generating article and device with improved heating efficiency. The induction heating-type aerosol-generating article according to some embodiments of the present disclosure includes a medium portion which includes an aerosol-forming substrate, a susceptor element which forms a closed loop to wrap around at least a portion of the medium portion and which is configured to, due to induction heating being performed therein, heat at least a portion of the medium portion, and an outer wrapper which wraps around at least a portion of the susceptor element. In this case, since the susceptor element is embedded in the aerosol-generating article and directly transmits heat to the medium portion, and an induced current may smoothly flow through the formed closed loop, heating efficiency may be significantly improved.

Abstract: The present disclosure relates to a method for refreshing a polishing pad, and, through increasing a useful life of a polishing pad used in a polishing process, is capable of reducing the amount of discarded polishing pad, and significantly enhancing polishing efficiency by shortening the time required to replace the polishing pad. In addition, a method for manufacturing a semiconductor device is a manufacturing process using the method for refreshing a polishing pad, wherein a polishing pad having the period of usage ended is reusable by having polishing performance equivalent to a new polishing pad, and process efficiency may be enhanced by reducing the number of replacements of polishing pads.

Abstract: Provided herein are an induction heating-type aerosol generation device, which has a function of determining the suitability of an aerosol-generating article, and a control method thereof. The induction heating-type aerosol generation device according to some embodiments of the present disclosure includes a housing which has an accommodation space for accommodating an aerosol-generating article, an inductor disposed to surround at least a portion of the aerosol-generating article accommodated in the accommodation space, and configured to inductively heat the accommodated aerosol-generating article, and a controller which controls the inductor. The controller may apply a predetermined article determining frequency to the inductor, may measure an electrical signal that changes according to the applied article determining frequency, and may determine suitability of the accommodated aerosol-generating article only on the basis of a result of measurement of the electrical signal, without an additional sensor.

Abstract: Provided are a polishing pad provided with a structural feature capable of maximizing the leakage prevention effect, the polishing pad including: a polishing layer including a first surface which is a polished surface and a second surface which is an opposite surface thereof, and including a first through hole passing through the first surface and the second surface; a window disposed in the first through hole; and a support layer disposed at the second surface of the polishing layer.

Abstract: The present disclosure is intended to provide, as a polishing pad to which a window for an endpoint detection is applied, and in which the window is capable of providing improved polishing performance in terms of preventing defects, etc., by a specific structure due to the window, rather than negatively affecting polishing performance as a local heterogeneous component on the polishing pad, a polishing pad including: a polishing layer including a first surface that is a polishing surface and a second surface that is a rear surface thereof, and containing a first through-hole penetrating from the first surface to the second surface; a window disposed in the first through-hole; and a void between a side surface of the first through-hole and a side surface of the window, and a method for manufacturing a semiconductor device by applying the same.