Abstract: A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Abstract: A method and apparatus are provided to aide in emergency egress of a structure. More particularly, egress indicators are co-located with hazard sensors. During detection of a hazard condition, locations of sensors detecting the hazard are identified and a pathway directing traffic away from the hazard is determined. Finally, the egress indicators are operated to direct traffic down the determined pathway.

Abstract: An alternating current (AC) powered self organizing wireless node (100, 400, 600) includes a self organizing wireless receiver-transmitter (115), an AC branch connection (105), an AC to direct current (DC) converter (110), a secondary power function (120), and a housing (150). The self organizing wireless receiver-transmitter can communicate information throughout a network of compatible self organizing nodes solely using radio transmission to and reception from nearby self-organizing nodes. The secondary power function can couple power to the AC to DC converter for powering the self organizing wireless receiver-transmitter when AC power is not provided. The AC powered self organizing wireless node is designed and fabricated for agency certification. The AC powered self organizing wireless node may include one or more sensors (125), sensor inputs (135), transducers (130), or control outputs (155).

Abstract: The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.

Abstract: The invention provides a method of attaching an area-array device such as a bumped flip chip to an electrical substrate. An underfill material is applied to a portion of the electrical substrate, and the underfill material is heated to an underfill-material staging temperature. A bumped area-array device is provided, the bumped area-array device including an interconnection surface and a plurality of connective bumps extending from the interconnection surface. The interconnection surface of the bumped area-array device is positioned adjacent the applied underfill material. The bumped area-array device is heated to electrically connect the connective bumps to the electrical substrate. The invention also provides a flip-chip assembly and a printed wiring board panel with pre-applied underfill material.

Abstract: A self supported underfill film (18) adhesively bonds surface mount integrated circuit packages (14) to a printed circuit board (10). The printed circuit board has conductive traces (12) and exposed conductive pads (13) on the surface. A film adhesive is strategically positioned on the printed circuit board near the conductive pads, and the surface mount integrated circuit package is then placed on the board so that the conductive pads (16) on the package align with the conductive pads on the board. The film adhesive softens when the package is soldered to the board, and the film ultimately serves as an underfill to increase the mechanical integrity of the solder joints.

Abstract: A bumped semiconductor device (10) exhibiting enhanced pattern recognition when illuminated in a machine vision system. The semiconductor device has a substantially coplanar array of solder bumps (16) and a coating of underfill material (17) on one face. A fluxing composition (18) containing an image enhancing agent is selectively deposited over at least two of the solder bumps in the array to modify the optical characteristics of the solder bumps to cause the solder bumps to appear bright against the background of the underfill material when the semiconductor device is illuminated (19) by selected wavelengths of light.

Abstract: A method for providing an underfill material on an integrated circuit chip at the wafer level. The wafer (10) typically contains one or more integrated circuit chips (12), and each integrated circuit chip typically has a plurality of solder bumps (34) on its active surface. The wafer is first diced (22) on the active surface side to form channels (38) that will ultimately define the edges (39) of each individual integrated circuit chip, the dicing being of such a depth that it only cuts part-way through the wafer. The front side (36) of the wafer is then coated (24) with an underfill material (40). Generally, a portion (45) of each solder bump remains uncoated, but in certain cases the bumps can be completely covered. The back side of the wafer is then lapped, ground, polished or otherwise treated (26) so as to remove material down to the level of the previously diced channels.

Abstract: An interposer-based semiconductor package (40) having at least one semiconductor die (21) attached to one side thereof also has, prior to placement on a printed wiring board (61), an underfill material (31) disposed at least partially thereon. Depending upon the embodiment, the underfill material (31) may initially cover interface electrodes (12) on the interposer (11). Such material (31) can be selectively removed to partially expose the interface electrodes (12). In other embodiments, apertures (101) can be left in the underfill material (31) during deposition, or formed after the underfill material (31) has been deposited, and the interface electrodes (12) subsequently formed in the apertures (101). Deposition of the underfill material (31) can be done with a single interposer-based package (40) or simultaneously with a plurality of such packages. Once deposited, the underfill material can be processed to render it relatively stable an substantially non-tacky.

Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer. In addition, formation of a compliant substrate may include utilizing surfactant enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials.