Abstract: Susceptors plates are formed having a minimum surface roughness. The wafer contact surfaces of the susceptor plates have a surface roughness Ra value of about 0.6 ?m or more. The contact surface is otherwise flat and lacking in large protrusions. In addition, the susceptors have a low transparency to more closely match the heat absorption properties of the supported wafer. Advantageously, heat transfer from the susceptors to the wafers is highly uniform. Thus, using these susceptors to support the wafers during high temperature semiconductor processing (e.g., at >1000° C.) results in no or few crystallographic slip lines being formed on the wafers.

Abstract: A receiver frame loads and unloads a batch of semiconductor wafers onto wafer holders in a wafer boat. The wafer holders extends continuously about the perimeter of an overlying wafer. The receiver frame is provided with a plurality of supporting arms which are immovably mounted to a vertically extending structure. The supporting arms are coaxially aligned and vertically spaced in a manner corresponding with the spacing of the wafer holders in the wafer boat. Each supporting arm is configured to be accommodated below a support ring, with its distal end extending to align with the center region of the wafer holder. The distal end of each supporting arm is provided with at least three support pins to support a wafer vertically spaced above a wafer holder. To load wafers onto the wafer holders, after placing the wafers upon the support pins, the wafer holders are moved above the support pins so that the wafer holders contact and lift the wafers off the support pins.

Abstract: A method and apparatus for batch processing of semiconductor wafers in a furnace advantageously allow for wafers to be supported for processing at very high temperatures (e.g., about 1350° C.). Each wafer is supported during processing by a wafer support with full perimeter support, such as a ring or plate. The wafers, on their supports, are removable and vertically spaced apart in a wafer support holder. A transfer station is provided wherein, during loading, a wafer is placed on a wafer support and, during unloading, the wafer is separated from the wafer support. A FOUP (Front Opening Unified Pod) is adapted to accommodate a plurality of wafer supports and to accommodate the transfer station. The wafer support, with a wafer supported on it, is transferred from the transfer station to a wafer support holder for processing.

Abstract: A receiver frame loads and unloads a batch of semiconductor wafers onto wafer holders in a wafer boat. The wafer holders extends continuously about the perimeter of an overlying wafer. The receiver frame is provided with a plurality of supporting arms which are immovably mounted to a vertically extending structure. The supporting arms are coaxially aligned and vertically spaced in a manner corresponding with the spacing of the wafer holders in the wafer boat. Each supporting arm is configured to be accommodated below a support ring, with its distal end extending to align with the center region of the wafer holder. The distal end of each supporting arm is provided with at least three support pins to support a wafer vertically spaced above a wafer holder. To load wafers onto the wafer holders, after placing the wafers upon the support pins, the wafer holders are moved above the support pins so that the wafer holders contact and lift the wafers off the support pins.

Abstract: A method and apparatus for batch processing of semiconductor wafers in a furnace advantageously allow for wafers to be supported for processing at very high temperatures (e.g., about 1350° C.). Each wafer is supported during processing by a wafer support with full perimeter support, such as a ring or plate. The wafers, on their supports, are removable and vertically spaced apart in a wafer support holder. A transfer station is provided wherein, during loading, a wafer is placed on a wafer support and, during unloading, the wafer is separated from the wafer support. A FOUP (Front Opening Unified Pod) is adapted to accommodate a plurality of wafer supports and to accommodate the transfer station. The wafer support, with a wafer supported on it, is transferred from the transfer station to a wafer support holder for processing.