Abstract: A module including at least two electrical components such as thyristors including a temperature sensor soldered on two conducting strips on a flat cable formed by a flexible dielectric plastic film glued onto the metallic electrode forming the top of one of the components and approximately at its center.

Abstract: A method of bonding a sheet of metal such as copper on a substrate of aluminum nitride, the method comprising the following steps known per se: i) growing a layer of alumina on the aluminum nitride substrate by means of heat treatment; and ii) placing the sheet of metal on the alumina layer and then bonding them together; the method being wherein alumina-growing step i) is performed under a controlled oxidizing atmosphere which is free from moisture.

Abstract: Disclosed is a method for the direct bonding of a copper sheet to a substrate made of an electrically insulating material, with the heating of the copper/substrate set in order to obtain a eutectic mixture. The method according to the invention consists in cleaning the copper to eliminate traces of oxidation on its surface before placing said copper on the substrate, in heating the copper/substrate set under a neutral atmosphere until a temperature greater than the temperature for the formation of the eutectic mixture is reached, and in applying the oxidating reactive gas only after the temperature greater than the temperature for the formation of the eutectic mixture is reached, in such a way that this temperature is reached before any oxidation of the surface of the copper.