Patents by Inventor Janusz Kaminski

Janusz Kaminski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the manufacture of micro solder bumps on copper pads
    Patent number: 6053397
    Abstract: Method for the manufacture of micro solder bumps, in which holes are structured by means of laser ablation in a mask, in order to produce solder bumps higher than the mask thickness. Through the additional use of a wobble plate in the production of trough-like stepped holes, micro solder bumps with an even larger volume can be produced.
    Type: Grant
    Filed: September 24, 1997
    Date of Patent: April 25, 2000
    Assignee: Hewlett-Packard Company
    Inventor: Janusz Kaminski