Patents by Inventor Jared Kole

Jared Kole has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9519852
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: December 13, 2016
    Assignee: Apple Inc.
    Inventors: Tang Yew Tan, Jason Sloey, Jared Kole, Naushad Zaveri
  • Publication number: 20150014421
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Application
    Filed: September 30, 2014
    Publication date: January 15, 2015
    Inventors: Tang Yew TAN, Jason SLOEY, Jared KOLE, Naushad ZAVERI
  • Patent number: 8909293
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Grant
    Filed: December 18, 2013
    Date of Patent: December 9, 2014
    Inventors: Tang Yew Tan, Jason Sloey, Jared Kole, Naushad Zaveri
  • Publication number: 20140106819
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Application
    Filed: December 18, 2013
    Publication date: April 17, 2014
    Applicant: Apple Inc.
    Inventors: Tang Yew TAN, Jason SLOEY, Jared KOLE, Naushad ZAVERI
  • Patent number: 8693204
    Abstract: Multi-purpose cowling structures are provided to minimize spacing impact within an electronic device, while maximizing functional utility. In one embodiment, an electromagnetic interference shield may provide one or more anchors for enabling a logic board cowling to apply sufficient downward force to one or more board connectors to prevent inadvertent disconnects. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board. A compass mounted on a flexible printed circuit board is also provided. Mounting the compass on a flexible printed circuit board enables the compass to be mounted remote from ferrous object that may affect the compass's performance.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: April 8, 2014
    Assignee: Apple Inc.
    Inventors: Shayan Malek, Jared Kole, Nikko Lubinski
  • Patent number: 8620271
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: December 31, 2013
    Assignee: Apple Inc.
    Inventors: Tang Yew Tan, Jason Sloey, Jared Kole, Naushad Zaveri
  • Publication number: 20120289196
    Abstract: A compact form factor integrated circuit card. In one embodiment, a Subscriber Identity Module (SIM) card is disclosed. In one embodiment, the SIM card has overall dimensions optimized for a particular application; e.g., 12.30 mm (±0.10 mm)×8.80 mm (±0.10 mm)×0.67 mm (+0.03/?0.07). In another embodiment, the SIM card has overall dimensions of 11.90 mm (±0.10 mm)×8.80mm (±0.10mm)×0.70 mm (maximum). Multiple complementary SIM card adapters and methods of use are also disclosed.
    Type: Application
    Filed: April 5, 2012
    Publication date: November 15, 2012
    Inventors: TANG YEW TAN, Jason Sloey, Jared Kole, Naushad Zaveri
  • Publication number: 20120176277
    Abstract: Multi-purpose cowling structures are provided to minimize spacing impact within an electronic device, while maximizing functional utility. In one embodiment, an electromagnetic interference shield may provide one or more anchors for enabling a logic board cowling to apply sufficient downward force to one or more board connectors to prevent inadvertent disconnects. In another embodiment, a cowling can electrically connect the ground plane of a logic board to the ground plane of a housing member and provide a pre-load force to a conductor connection existing on logic board. A compass mounted on a flexible printed circuit board is also provided. Mounting the compass on a flexible printed circuit board enables the compass to be mounted remote from ferrous object that may affect the compass's performance.
    Type: Application
    Filed: January 10, 2011
    Publication date: July 12, 2012
    Applicant: Apple Inc.
    Inventors: Shayan Malek, Jared Kole, Nikko Lubinski
  • Patent number: D741333
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: October 20, 2015
    Assignee: Apple Inc.
    Inventors: Shota Aoyagi, Martin Auclair, Richard P. Howarth, Jared Kole, Scott A. Myers, David A. Pakula
  • Patent number: D765084
    Type: Grant
    Filed: September 10, 2013
    Date of Patent: August 30, 2016
    Assignee: Apple Inc.
    Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, Daniel J. Coster, Daniele De Iuliis, M. Evans Hankey, Matthew David Hill, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Jared Kole, Stefan Mag, Nicholas George LeBreton Merz, Scott A. Myers, Benjamin J. Pope, Matthew Rao, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Rico Zörkendörfer
  • Patent number: D873832
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 28, 2020
    Assignee: Apple Inc.
    Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, Daniel J. Coster, Daniele De Iuliis, M. Evans Hankey, Matthew David Hill, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Duncan Robert Kerr, Jared Kole, Stefan Mag, Nicholas George LeBreton Merz, Scott A. Myers, Benjamin J. Pope, Matthew Rao, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Rico Zörkendörfer
  • Patent number: D906306
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: December 29, 2020
    Assignee: Apple Inc.
    Inventors: Jody Akana, Bartley K. Andre, Shota Aoyagi, Jeremy Bataillou, Miguel Christophy, Daniel J. Coster, Daniele De Iuliis, Richard Hung Minh Dinh, M. Evans Hankey, Julian Hoenig, Richard P. Howarth, Jonathan P. Ive, Daniel W. Jarvis, Duncan Robert Kerr, Jared Kole, Kelvin Kwong, Shayan Malek, Benjamin J. Pope, Matthew Dean Rohrbach, Peter Russell-Clarke, Mikael Silvanto, Christopher J. Stringer, Tang Yew Tan, Eugene Antony Whang, Rico Zörkendörfer