Patents by Inventor Jarett Rinaldi

Jarett Rinaldi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090212196
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Application
    Filed: April 27, 2009
    Publication date: August 27, 2009
    Inventors: Al LaValle, Patrick D. Boyd, Jarett Rinaldi
  • Patent number: 7525405
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: April 19, 2005
    Date of Patent: April 28, 2009
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Patent number: 6993834
    Abstract: A device and method including a slot insertion member is to hold a number of card edge slots having a plurality of pins extending from them in alignment for insertion of the plurality of pins into a plurality of holes of a printed circuit board. At least one grip attachment member is connected to the plurality of slot insertion members to hold the plurality of slot insertion members in a fixed position. At least one grip member is connected to at least one grip attachment member to enable the holding and positioning of the slot holder.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: February 7, 2006
    Assignee: Intel Corporation
    Inventors: Patrick D. Boyd, Al LaValle, Jarett Rinaldi
  • Publication number: 20050184844
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Application
    Filed: April 19, 2005
    Publication date: August 25, 2005
    Inventors: Al Valle, Patrick Boyd, Jarett Rinaldi
  • Patent number: 6880232
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Grant
    Filed: September 26, 2001
    Date of Patent: April 19, 2005
    Assignee: Intel Corporation
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi
  • Publication number: 20050030147
    Abstract: A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.
    Type: Application
    Filed: September 20, 2004
    Publication date: February 10, 2005
    Inventors: Jarett Rinaldi, Patrick Boyd, Al Lavalle
  • Patent number: 6809625
    Abstract: A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: October 26, 2004
    Assignee: Intel Corporation
    Inventors: Jarett Rinaldi, Patrick D. Boyd, Al LaValle
  • Publication number: 20030117253
    Abstract: A connector to supply power or communications to a printed circuit board having positive thermal coefficient switches embedded in or mounted on the connector. These positive thermal coefficient switches are linked to connector leads that in turn are connected to leads/traces embedded in or on the printed circuit board. The connector using these positive thermal coefficient switches protects the circuitry of the printed circuit board from possible damage.
    Type: Application
    Filed: December 20, 2001
    Publication date: June 26, 2003
    Inventors: Jarett Rinaldi, Patrick D. Boyd, Al LaValle
  • Publication number: 20030056979
    Abstract: A device and method to hold a number of card edge slots in a fixed position inserting pins contained on these card slots simultaneously into a printed circuit board. This device and method prevents tilting of the card edge slots from occurring due to improper installation or the action of a wave solder machine. This device and method uses a number of slot insertion members connected to a grip attachment member to rigidly hold the card edge slots in alignment.
    Type: Application
    Filed: September 24, 2001
    Publication date: March 27, 2003
    Inventors: Patrick D. Boyd, Al LaValle, Jarett Rinaldi
  • Publication number: 20030058074
    Abstract: A method for forming electronic inductors. A model of the desired shape of the inductor is first formed in wax or other soft material. It is compressed in a block of magnetically permeable material and then heated to remove the wax shape. The resultant cavity in the shape of the inductor is filled with conductive material to form an inductor within the magnetically permeable material block.
    Type: Application
    Filed: September 26, 2001
    Publication date: March 27, 2003
    Inventors: Al La Valle, Patrick D. Boyd, Jarett Rinaldi