Patents by Inventor Jari Hiltunen
Jari Hiltunen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8130312Abstract: A reflowable camera module is implemented using a Chip Scale Package (CSP). An image sensor is formed on one portion of the carrier. A light emitting diode (LED) is formed on another portion of the carrier. The LED serves as an integrated camera flash. Additional optical isolation is provided within the camera module to prevent stray light generated by the LED from degrading image quality.Type: GrantFiled: December 17, 2008Date of Patent: March 6, 2012Assignee: OmniVision Technologies, Inc.Inventors: Jari Hiltunen, Jess Jan Young Lee
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Patent number: 7939940Abstract: A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP.Type: GrantFiled: December 18, 2007Date of Patent: May 10, 2011Assignee: OmniVision Technologies, Inc.Inventor: Jari Hiltunen
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Patent number: 7911019Abstract: A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused by shear forces, particularly in corner regions. Additional localized mechanical supports are provided to protect those solder joints carrying power and electrical signals for the camera module. The localized mechanical supports are formed outside of a region containing the solder joints carrying power and electrical signals. The localized mechanical supports may include dummy solder joints formed in corner regions and/or dummy leads used to support the camera module. Solder joint reliability is enhanced without requiring the use of an underfill encapsulant.Type: GrantFiled: March 16, 2010Date of Patent: March 22, 2011Assignee: OmniVision Technologies, Inc.Inventors: Jari Hiltunen, Ian Montandon
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Publication number: 20100171192Abstract: A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused by shear forces, particularly in corner regions. Additional localized mechanical supports are provided to protect those solder joints carrying power and electrical signals for the camera module. The localized mechanical supports are formed outside of a region containing the solder joints carrying power and electrical signals. The localized mechanical supports may include dummy solder joints formed in corner regions and/or dummy leads used to support the camera module. Solder joint reliability is enhanced without requiring the use of an underfill encapsulant.Type: ApplicationFiled: March 16, 2010Publication date: July 8, 2010Inventors: Jari Hiltunen, Ian Montandon
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Publication number: 20090152720Abstract: A resin coated copper foil is used to fabricate a multilayer Chip Scale Package (CSP). A CSP package base has a first electrical routing layer. A resin coated copper foil is hot pressed onto the CSP package base and then patterned to form a second electrical routing layer. Conductive vias are then formed between the electrical routing layers. An Organic Solder Preservative (OSP) is used a surface finish for solder balls of the CSP.Type: ApplicationFiled: December 18, 2007Publication date: June 18, 2009Inventor: Jari Hiltunen
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Publication number: 20090152659Abstract: A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused by shear forces, particularly in corner regions. Additional localized mechanical supports are provided to protect those solder joints carrying power and electrical signals for the camera module. The localized mechanical supports are formed outside of a region containing the solder joints carrying power and electrical signals. The localized mechanical supports may include dummy solder joints formed in corner regions and/or dummy leads used to support the camera module. Solder joint reliability is enhanced without requiring the use of an underfill encapsulant.Type: ApplicationFiled: December 18, 2007Publication date: June 18, 2009Inventors: Jari Hiltunen, Ian Montandon
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Publication number: 20090153729Abstract: A reflowable camera module is implemented using a Chip Scale Package (CSP). An image sensor is formed on one portion of the carrier. A light emitting diode (LED) is formed on another portion of the carrier. The LED serves as an integrated camera flash. Additional optical isolation is provided within the camera module to prevent stray light generated by the LED from degrading image quality.Type: ApplicationFiled: December 17, 2008Publication date: June 18, 2009Inventors: Jari Hiltunen, Jess Jan Young Lee
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Patent number: 7268335Abstract: The present invention relates to image sensing devices, image sensor modules, and associated methods. One aspect of the invention is directed toward an imaging device that includes a carrier having a first surface, a second surface generally opposite the first surface, and carrier contacts. The carrier contacts are carried on the second surface of the carrier. The device further includes an image sensor module having light sensing elements and a support. The support has a first surface, a second surface generally opposite the first surface, and support contacts. The image sensor module is located relative to the carrier so that a portion of the first surface of the support faces a portion of the second surface of the carrier and so that a portion of the image sensor module extends past the first and second surfaces of the carrier.Type: GrantFiled: January 27, 2006Date of Patent: September 11, 2007Assignee: Omnivision Technologies, Inc.Inventor: Jari Hiltunen
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Publication number: 20070176086Abstract: The present invention relates to image sensing devices, image sensor modules, and associated methods. One aspect of the invention is directed toward an imaging device that includes a carrier having a first surface, a second surface generally opposite the first surface, and carrier contacts. The carrier contacts are carried on the second surface of the carrier. The device further includes an image sensor module having light sensing elements and a support. The support has a first surface, a second surface generally opposite the first surface, and support contacts. The image sensor module is located relative to the carrier so that a portion of the first surface of the support faces a portion of the second surface of the carrier and so that a portion of the image sensor module extends past the first and second surfaces of the carrier.Type: ApplicationFiled: January 27, 2006Publication date: August 2, 2007Applicant: OmniVision Technologies, Inc.Inventor: Jari Hiltunen
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Publication number: 20070052827Abstract: Coated wafer level camera modules and associated methods are disclosed. One aspect of the invention is directed toward a wafer level camera module that includes a die having multiple image sensor integrated circuits. The module can further include a coating covering at least a portion of the die. The coating can be configured to provide at least a partial shield against selected types of electromagnetic energy. The module can still further include multiple contacts positioned to electrically couple the integrated circuits to a support. In certain embodiments, the selected types of electromagnetic energy can include one or more selected frequencies of light.Type: ApplicationFiled: September 7, 2005Publication date: March 8, 2007Applicant: OmniVision Technologies, Inc.Inventor: Jari Hiltunen
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Publication number: 20040212718Abstract: A portable electronic device, which comprises at least a camera module and a printed wiring board for placing the camera module and other structures. The camera module comprises an optics zone comprising an input aperture, and a connector zone, which comprises contacts for connecting the camera module to counter-contacts. In the device, the optics zone and the connector zone of the camera module are placed on different sides of the printed wiring board. In addition, the invention comprises a camera module, a frame structure, a printed wiring board, a combination of a frame structure and a printed wiring board, and a method for placing the camera module in a portable device.Type: ApplicationFiled: January 16, 2004Publication date: October 28, 2004Applicant: Nokia CorporationInventors: Jari Hiltunen, Janne Haavisto
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Patent number: D399640Type: GrantFiled: August 26, 1997Date of Patent: October 20, 1998Assignee: Caminno Consulting Oy AbInventor: Jari Hiltunen