Abstract: A method for producing a polymer for semiconductor optoelectronics, comprising the steps of providing a monomer is produced having the formula: wherein: R1 is a hydrolysable group R2 is hydrogen, and R3 is a bridging linear or branched bivalent hydrocarbyl group, said monomer being produced by hydrosilylation of the corresponding starting materials, and homo- or copolymerizing the monomer to produce a polymer.

Abstract: A method for making an integrated circuit device by: forming a plurality of transistors on a semiconductor substrate; forming multilayer interconnects by depositing a layer of metal; patterning the metal layer; depositing a first dielectric material, depositing a second dielectric material, patterning the first and second dielectric materials; and depositing a via filling metal material into the patterned areas; or, alternatively, by forming transistors on a substrate; depositing one of an electrically insulating or electrically conducting material; patterning said one of an electrically insulating or electrically conducting material; and depositing the other of the electrically insulating or electrically conducting material, so as to form a layer over said transistors having both electrically insulating and electrically conducting portions; wherein the first dielectric material, which is an organosiloxane material, and the electrically insulating material each has a carbon to silicon ratio of 1.

Abstract: A method for producing a polymer for semiconductor optoelectronics, comprising the steps of providing a monomer is produced having the formula: wherein: R1 is a hydrolysable group R2 is hydrogen, and R3 is a bridging linear or branched bivalent hydrocarbyl group, said monomer being produced by hydrosilylation of the corresponding starting materials, and homo- or copolymerizing the monomer to produce a polymer.

Abstract: A thin film comprising a composition obtained by polymerizing a monomer having the formula I: wherein: R1 is a hydrolysable group, R2 is a polarizability reducing organic group, and R3 is a bridging hydrocarbon group, to form a siloxane material. The invention also concerns methods for producing the thin films. The thin film can be used a low k dielectric in integrated circuit devices. The novel dielectric materials have excellent properties of planarization resulting in good local and global planarity on top a semiconductor substrate topography, which reduces or eliminates the need for chemical mechanical planarization after dielectric and oxide liner deposition.

Abstract: The present invention relates to thin films suitable as dielectrics in integrated circuits and for other similar applications and to methods for the production thereof. In particular, the invention concerns thin films comprising at least partially cross-linked siloxane structures obtainable by hydrolysis of one or more silicon compounds of the general formula R1—R2—Si—(X1)3, wherein X1 is a leaving group, R2 is a cycloalkyl having from 3 to 16 carbon atoms, an aryl having from 5 to 18 carbon atoms or a polycyclic alkyl group having from 7 to 16 carbon atoms, and R1 is a substituent of R2 selected from alkyl groups having from 1 to 4 carbon atoms, alkenyl groups having from 2 to 5 carbon atoms, alkynyl groups having from 2 to 5 carbon atoms, and aromatic groups having 5 or 6 carbon atoms, each of said groups being optionally substituted, and Cl and F.

Abstract: A thin film comprising a composition obtained by polymerizing a monomer having the formula I: wherein: R1 is a hydrolysable group, R2 is an organic crosslinking group, a reactive cleaving group or a polarizability reducing organic group, and R3 is a bridging linear or branched bivalent hydrocarbyl group to form a siloxane material. The organo-functionalized molecule is capable of further reacting in the matrix so as to undergo cross-linking, cleaving or combination of both. The present invention provides excellent chemical resistance and very low chemical adsorption behavior due to high cross-linking bridging group density.

Abstract: A method for producing a polymer for semiconductor optoelectronics, comprising the steps of providing a monomer is produced having the formula: wherein: R1 is a hydrolysable group R2 is hydrogen, and R3 is a bridging linear or branched bivalent hydrocarbyl group, said monomer being produced by hydrosilylation of the corresponding starting materials, and homo- or copolymerizing the monomer to produce a polymer.

Abstract: A thin film comprising a composition obtained by polymerizing a monomer having the formula I: wherein: R1 is a hydrolysable group, R2 is a polarizability reducing organic group, and R3 is a bridging hydrocarbon group, to form a siloxane material. The invention also concerns methods for producing the thin films. The thin film can be used a low k dielectric in integrated circuit devices. The novel dielectric materials have excellent properties of planarization resulting in good local and global planarity on top a semiconductor substrate topography, which reduces or eliminates the need for chemical mechanical planarization after dielectric and oxide liner deposition.

Abstract: A compound of the general formula: R1R2R4MR5, wherein R1, R2 and R4 are independently an aryl, alkyl, alkenyl or alkynyl group, wherein at least one of R1, R2 and R4 is fully or partially fluorinated, wherein M is selected from group 14 of the periodic table, and wherein R5 is either an alkoxy group, OR3, or a halogen group, X. This compound formed can be further reacted to attach an additional organic R group, and/or hydrolyzed with one or more similar compounds (preferably having one or two R groups bound to M), to form a material having a molecular weight of from 500 to 10,000, which material can be deposited on various substrates as a coating or deposited and patterned for a waveguide or other optical device components. Methods for making and using compounds of the general formula R1R2R4MR5 are also disclosed.

Abstract: A compound of the general formula R1MR4R5R6 is provided where R1 is a partially or fully fluorinated aryl, alkyl, alkenyl or alkynyl group, wherein M is selected from group 14 of the periodic table, wherein R4, R5 and R6 are independently an alkoxy group OR3 or a halogen group X—except, a) where R4, R5 and R6 are each ethoxy, M is Si and R1 is perfluorinated phenyl or perfluorinated vinyl; b) where R4 is ethoxy, R5 and R6 are chlorine, M is Si, and R1 is perfluorinated phenyl; or c) where R4, R5 and R6 are chlorine, M is Si, and R1 is perfluorinated phenyl, perfluorinated methyl or perfluorinated vinyl. This compound formed can be further reacted to attach an additional organic R group, and/or hydrolyzed, alone or with one or more similar compounds, to form a material having a molecular weight of from 500 to 10,000, which material can be deposited on various substrates as a coating or deposited and patterned for a waveguide or other optical device components.