Patents by Inventor Jarkko TORVINEN
Jarkko TORVINEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11528802Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.Type: GrantFiled: December 23, 2019Date of Patent: December 13, 2022Assignee: TACTOTEK OYInventors: Tapio Rautio, Tomi Simula, Minna Pirkonen, Jarkko Torvinen, Tuukka Junkkari, Janne Asikkala, Hasse Sinivaara
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Patent number: 11516920Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.Type: GrantFiled: March 29, 2021Date of Patent: November 29, 2022Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 11406021Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: GrantFiled: December 21, 2021Date of Patent: August 2, 2022Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 11363720Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: GrantFiled: August 28, 2020Date of Patent: June 14, 2022Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20220117091Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: December 21, 2021Publication date: April 14, 2022Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20210243898Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.Type: ApplicationFiled: March 29, 2021Publication date: August 5, 2021Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20210195731Abstract: A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.Type: ApplicationFiled: December 23, 2019Publication date: June 24, 2021Inventors: Tapio RAUTIO, Tomi Simula, Minna Pirkonen, Jarkko Torvinen, Tuukka Junkkari, Janne Asikkala, Hasse Sinivaara
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Patent number: 10986734Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: September 25, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986733Abstract: A method for manufacturing an electromechanical structure, includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the said film in relation to the desired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film, wherein a preferred layer of material is attached on the surface of the film. A corresponding arrangement for carrying out the method is also presented.Type: GrantFiled: November 15, 2017Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10986735Abstract: A method for manufacturing an electromechanical structure includes producing conductors on a flat film and estimating a strain that a plurality of locations on the flat film will undergo during formation of the flat film into a three-dimensional film. The method further includes attaching electronic elements on the flat film at selected locations of the plurality of locations on the flat film. The estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations. The method further includes forming the flat film into the three-dimensional film and injection molding material on the three-dimensional film.Type: GrantFiled: October 24, 2018Date of Patent: April 20, 2021Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Publication number: 20200396841Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: August 28, 2020Publication date: December 17, 2020Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10813222Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: GrantFiled: January 21, 2020Date of Patent: October 20, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10660211Abstract: A method for manufacturing an electromechanical structure includes producing conductors and/or graphics on a substantially flat film, attaching electronic elements on the film in relation to a desired three-dimensional shape of the film, forming the film into the substantially three-dimensional shape, and using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film.Type: GrantFiled: September 25, 2014Date of Patent: May 19, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keranen
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Publication number: 20200154573Abstract: A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure.Type: ApplicationFiled: January 21, 2020Publication date: May 14, 2020Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10642433Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.Type: GrantFiled: February 18, 2019Date of Patent: May 5, 2020Assignee: TACTOTEK OYInventors: Jarmo Sääski, Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen
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Patent number: 10575407Abstract: A system for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.Type: GrantFiled: June 26, 2018Date of Patent: February 25, 2020Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen
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Patent number: 10383232Abstract: A multilayer structure for an electronic device including a flexible substrate film for accommodating electronics; at least one electronic component provided on the substrate film; and a number of conductive traces provided on the substrate film for electrically powering and/or connecting electronics including the at least one electronic component, wherein at least one preferably thermoformed cover is attached to the substrate film on top of the at least one electronic component, the at least one thermoformed cover and the substrate film accommodating the electronics being overmolded with thermoplastic material. The invention also relates to a method for manufacturing a multilayer structure for an electronic device.Type: GrantFiled: March 27, 2018Date of Patent: August 13, 2019Assignee: TACTOTEK OYInventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen
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Publication number: 20190179455Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.Type: ApplicationFiled: February 18, 2019Publication date: June 13, 2019Inventors: Jarmo Sääski, Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen
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Patent number: 10248277Abstract: An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.Type: GrantFiled: October 10, 2018Date of Patent: April 2, 2019Assignee: TACTOTEK OYInventors: Jarmo Sääski, Jarkko Torvinen, Pasi Raappana, Mikko Heikkinen
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Publication number: 20190098763Abstract: A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.Type: ApplicationFiled: October 24, 2018Publication date: March 28, 2019Inventors: Mikko Heikkinen, Jarmo Sääski, Jarkko Torvinen, Paavo Niskala, Mikko Sippari, Pasi Raappana, Antti Keränen