Abstract: A system for cooling a component in a computer system is disclosed. The cooling system of the present invention comprises a heat collection chamber including an inlet opening and an outlet opening, wherein the inlet opening is located in a position vertically higher than a location of the outlet opening. The system includes a heat conductive jacket adapted to be in thermal contact with the component. The jacket includes an inlet port and an outlet port through which a cooling fluid circulates. The system also includes a first hollow tube for coupling the outlet port to the inlet opening, and a second hollow tube for coupling the outlet opening to the inlet port.

Abstract: A heat sink assembly in accordance with the present invention is disclosed. The assembly comprises a heat sink and at least one clip coupled to the heat sink via a plurality of two features. The plurality of features allow for alignment of the clip to the heat sink. The at least one clip further includes a plurality of legs. Thereby, a tool is not required to couple the clip to the heat sink. A heat sink to circuit board assembly is provided which in a preferred embodiment utilizes two clips affixed to the heat sink. The heat sink in a preferred embodiment includes two protruding features which allow for the alignment and engagement of the two clips therewith. These features allow for ease of assembly of the heat sink to the clip without requiring a tool. The heat sink is then aligned over a chip located on the circuit board, the legs are then extended through the circuit board allowing for rigid assembly and grounding.

Abstract: An integrated cooling and retention bracket is detachably coupled to a computer processor cartridge having a heatsink mounted thereto. The bracket is U-shaped with a cross-bar and a short, perpendicular arm on each end of the cross-bar. The lower end of each arm acts as a hinge for an upward-turned extension on the outer side of each arm. Each extension has a rounded knob at its tip and an outward protruding tooth therebelow. An integrally formed, cooling fan mounting structure is located on top of the cross-bar. The mounting structure has two side panels with a central opening therebetween for holding a conventional cooling fan, which is snap mounted inside the central opening. The cartridge and bracket assembly is installed in a retention mechanism on a printed circuit board. The teeth on the bracket snap into holes in the posts in the retention mechanism to electrically interconnect the processor cartridge to the circuit board.

Abstract: A computer system includes a housing that is divided into three compartments; two fan compartments, each containing a fan, and a third compartment containing heat generating electronic components. The air discharged from the fans flows through outlets in the fan compartments and into the third compartment to cool the electronic components. A single baffle is rotatably coupled between the two fan compartments using a vertically oriented hinge. When one of the fans fails, the air pressure from the working fan rotates the baffle until it covers the outlet of the fan compartment containing the failed fan. This enhances the flow of air from the working fan into the third compartment, and restricts the reverse flow of air through the dead fan compartment. When both fans are functioning, air pressure from both fans moves the baffle to a "midway" or "neutral" position, such that the air from both fans flows into the third compartment.