Abstract: An enema assist device is provided. The device includes a support and the support is configured to be placed on a toilet bowl such that the support front is oriented towards the front of the toilet bowl. The support is configured to support a fluid delivery tip such that the fluid delivery tip is disposed on the top surface of the support and protrudes at least partially beyond a plane defined by a top of the toilet seat.

Abstract: A cleaning method to remove ink from the surface of a semiconductor wafer includes securing the wafer to a spin chuck, submerging the spinning wafer into an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer, spraying a cleaning solution onto the surface of the spinning wafer to clean the ink off the surface of the wafer, and blowing gas onto the surface of the spinning wafer so as to remove residue from the surface of the wafer.

Abstract: The present invention provides a cleaning system for removing ink from the surface of a semiconductor wafer. The cleaning system comprises a first cleaning station, a second cleaning station and a drying station. The first cleaning station spins the wafer and uses an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer. The second cleaning station also spins the wafer and uses another cleaning solution to clean the ink off the surface of the wafer. The drying station spins the wafer and uses a gas to blow the surface of the wafer so as to remove residue from the surface of the wafer.

Abstract: A cleaning method to remove ink from the surface of a semiconductor wafer includes securing the wafer to a spin chuck, submerging the spinning wafer into an N-Methyl-Pyrolidone (NMP) solution to dissolve the ink on the surface of the semiconductor wafer, spraying a cleaning solution onto the surface of the spinning wafer to clean the ink off the surface of the wafer, and blowing gas onto the surface of the spinning wafer so as to remove residue from the surface of the wafer.

Abstract: A storage box is provided for the safe-keeping of fabricated or semi-fabricated semiconductor wafers. This wafer storage box allows the wafers to be tightly secured in position when held in the storage box for storage or shipping without the possibility of breaking the wafers as in the prior art. The wafer storage box includes a receptacle member having a first piece of soft material such as anti-static sponge on the inside thereof, a holding member which is accommodated in the receptacle member, and a covering member having a second piece of soft material such as anti-static sponge on the inside thereof. When the covering member is mounted on the receptacle member, the first and second pieces of anti-static sponge are disposed on opposite sides of the holding member, thus pressing against the wafers to secure them in position in the storage box.

Abstract: A cuboid wafer container consists of a top bucket and a bottom bucket. The top bucket further consists of a square bucket and a cylindrical bucket, the same does the bottom bucket. The cylindrical bucket and the square bucket are connected through cushion to absorb vibration for protect the wafers from being damaged by the vibration. The wafer container according to the invention can be opened and sealed without screwing the buckets, so that damages occurred on the surfaces of wafers is reduced.