Abstract: Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.

Abstract: Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.

Abstract: Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.

Abstract: Customized patient-specific instruments configured to be selectively attached at predetermined locations of a patient's bone are disclosed. The customized patient-specific instruments may include a polymeric body including a bone-facing surface having a customized patient-specific negative contour shaped to match and receive a corresponding positive contour of the patient's bone at the predetermined location. The customized patient-specific instruments also include a metallic coating that defines one or more cutting slots. A method of performing an orthopaedic surgical procedure is also disclosed.

Abstract: Medical implants exhibiting optimized mechanical properties, and methods of making such implants, are disclosed. That is, the implants are fabricated of a porous metal substrate and include coating integrated over various areas so as to provide some added or desirable property or functionality to the implant. In one embodiment, the implant is an acetabular implant with a coating applied to an internal, concave wear surface which is sized and configured to receive a head of a femur. Typically, the coating is a ceramic incorporated onto the desired area of the implant via electrophoretic deposition.

Abstract: Medical implants exhibiting optimized mechanical properties, and methods of making such implants, are disclosed. That is, the implants are fabricated of a porous metal substrate and include coating integrated over various areas so as to provide some added or desirable property or functionality to the implant. In one embodiment, the implant is an acetabular implant with a coating applied to an internal, concave wear surface which is sized and configured to receive a head of a femur. Typically, the coating is a ceramic incorporated onto the desired area of the implant via electrophoretic deposition.

Abstract: An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is formed from material on the same side of the substrate as the capacitor. In some versions of the invention, the resistor is formed on top of a substrate dielectric layer. In these versions of the invention, a conductor both functions as one of the capacitor's electrodes and connects the resistor to the capacitor. In alternative versions of the invention, the resistor is formed from a film that disposed on the undersurface a metal foil. The foil functions as the resistor to capacitor conductor. Sections of the foil that are removed expose and define the resistor. Solder balls or other connectors on the substrate surface connect the network to another component.

Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. The pressure sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is brazed to the housing in the aperture. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor is mounted to one end of the substrate. A reference resistor is mounted to another end of the substrate. A circuit line is located on the substrate. The circuit line is connected between the pressure sensitive resistor and the reference resistor.

Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. In one embodiment, the pressure sensor has a high pressure side and a low pressure side. An aperture may extend through at least a portion of the sensor assembly, and a seal is located in the aperture. The seal seals the high pressure side from the low pressure side. Electrical leads extend through the seal between the high pressure side and the low pressure side. A substrate is located on the high pressure side. A pressure sensitive resistor is mounted on the substrate such that the resistor is directly exposed to the pressurized medium. The resistor changes resistance in response to a change in pressure. The resistor is connected to the electrical leads.

Abstract: An R-C network formed on a substrate. The capacitor includes a metal member with anodized and unanodized layers. The unanodized layer functions as one of the capacitor's electrodes. The anodized layer functions as the capacitor's dielectric layer. The resistor is formed from material on the same side of the substrate as the capacitor. In some versions of the invention, the resistor is formed on top of a substrate dielectric layer. In these versions of the invention, a conductor both functions as one of the capacitor's electrodes and connects the resistor to the capacitor. In alternative versions of the invention, the resistor is formed from a film that disposed on the undersurface a metal foil. The foil functions as the resistor to capacitor conductor. Sections of the foil that are removed expose and define the resistor. Solder balls or other connectors on the substrate surface connect the network to another component.

Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. The pressure sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is brazed to the housing in the aperture. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor is mounted to one end of the substrate. A reference resistor is mounted to another end of the substrate. A circuit line is located on the substrate. The circuit line is connected between the pressure sensitive resistor and the reference resistor.

Abstract: A temperature and pressure sensor for sensing the temperature and pressure of a media and providing electrical signals that are indicative of the temperature and pressure level of the media. The sensor includes a housing that has a high pressure side, a low pressure side and an aperture. A substrate is located in the aperture. The substrate has a pair of ends and a center portion. The center portion is affixed to the housing. The center portion seals the high pressure side from the low pressure side. A pressure sensitive resistor and a thermistor are mounted on one end of the substrate and a reference resistor is mounted on the other end of the substrate.

Abstract: A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

Abstract: A ball grid array resistor network has a planar substrate formed of an organic material. The substrate preferably is a printed circuit board. The substrate has a top and bottom surface. A ball pad is located on the bottom surface. A low temperature resistor is located on the bottom surface and is connected to the ball pad. A solder mask is located over the first surface except for the ball pads. A conductive ball is attached to the ball pad. A reflowed solder paste connects the conductive ball to the ball pad. Several embodiments of the invention are shown.

Abstract: A pressure sensor for sensing a pressure level of a pressurized medium. In one embodiment, the pressure sensor has a high pressure side and a low pressure side. An aperture may extend through at least a portion of the sensor assembly, and a seal is located in the aperture. The seal seals the high pressure side from the low pressure side. Electrical leads extend through the seal between the high pressure side and the low pressure side. A substrate is located on the high pressure side. A pressure sensitive resistor is mounted on the substrate such that the resistor is directly exposed to the pressurized medium. The resistor changes resistance in response to a change in pressure. The resistor is connected to the electrical leads.