Abstract: A method for digitally printing a decorative surface material is disclosed, including providing a substrate to a digital printer, printing a print material onto a top surface of the print substrate, and curing the print material. The method also includes applying an adhesive to a back surface of the decorative print and applying the decorative print to an interior panel. The print material includes a visible or variable image, or a textured surface. The decorative surface material may provide a decorative interior panel for an aerospace vehicle, such as a wall covering. The substrate may include a flame barrier material, aluminum, or fiberglass.

Abstract: An event management system and method for organizing and facilitating wrestling matches, as well as better matching of the wrestlers, utilizing storing and displaying results and ratings from wrestling events, analyzing the results and ratings and generating Elo-derived ratings and weigh-adjusted Elo-derived ratings for participants, and predicting the probability that a given participant will defeat another using the accurate Elo-derived ratings and weigh-adjusted Elo-derived ratings.

Abstract: A wafer support system comprising a susceptor having top and bottom sections and gas flow passages therethrough. One or more spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer.