Patents by Inventor Jason Michael Doub

Jason Michael Doub has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing residual contamination in singulated semiconductor die
    Patent number: 10026605
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: July 17, 2018
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jason Michael Doub, Gordon M. Grivna
  • METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE
    Publication number: 20160372323
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
    Type: Application
    Filed: September 2, 2016
    Publication date: December 22, 2016
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jason Michael DOUB, Gordon M. GRIVNA
  • Method of reducing residual contamination in singulated semiconductor die
    Patent number: 9472458
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: October 18, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jason Michael Doub, Gordon M. Grivna
  • METHOD OF REDUCING RESIDUAL CONTAMINATION IN SINGULATED SEMICONDUCTOR DIE
    Publication number: 20150357241
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
    Type: Application
    Filed: February 3, 2015
    Publication date: December 10, 2015
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jason Michael Doub, Gordon M. Grivna