Abstract: Disclosed is a method, system, and computer program product for implementing controlled breaks using sub-resolution assist features. Sub-resolution bridging features are added to implement controlled breaks between features on the layout. The bridging features may also be used to facilitate or optimize multiple mask/exposure techniques that split a layout or features on a layout to address pitch problems.

Abstract: Apparatuses and methods of shuttering glasses are disclosed. One apparatus includes a first lens operable to blank for a first blocking time, a second lens operable to blank for a second blocking time, and a controller for controllably setting at least one of the first blocking time and the second blocking time.

Abstract: A coated medium for inkjet printing, which includes a supporting substrate and a coating layer formed on at least one side thereof. The coating layer includes at least one binder and at least two different inorganic pigments: modified calcium carbonate (MCC) and either precipitated calcium carbonate (PCC) or clay.

Abstract: An inkjet recording material which comprises a supporting substrate, a first bottom base coat applied to at least one surface of said substrate, and a second topcoat layer applied over said base coat. In said inkjet recording material, the base coat includes a combination of at least three pigments and the topcoat layer comprises pigments selected from the group consisting of fumed silica, silica gel, precipitated silica, colloidal silica, fumed alumina, boehmite, pseudo-boehmite or a mixture thereof.

Abstract: Disclosed is a method, system, and computer program product for implementing controlled breaks using sub-resolution assist features. Sub-resolution bridging features are added to implement controlled breaks between features on the layout. The bridging features may also be used to facilitate or optimize multiple mask/exposure techniques that split a layout or features on a layout to address pitch problems.

Abstract: Disclosed is a method, system, and computer program product for implementing controlled breaks using sub-resolution assist features. Sub-resolution bridging features are added to implement controlled breaks between features on the layout. The bridging features may also be used to facilitate or optimize multiple mask/exposure techniques that split a layout or features on a layout to address pitch problems.

Abstract: Disclosed is a method, system, and computer program product for implementing controlled breaks using sub-resolution assist features. Sub-resolution bridging features are added to implement controlled breaks between features on the layout. The bridging features may also be used to facilitate or optimize multiple mask/exposure techniques that split a layout or features on a layout to address pitch problems.

Abstract: A print medium suitable for inkjet web press printing is disclosed herein. The print medium includes a paper substrate and an ink-receiving layer coated onto at least one surface of the paper substrate. The ink-receiving layer includes: two different inorganic pigments with different particle sizes; a binder; a water-soluble metallic salt; and a colorant durability enhancer selected from the group consisting of boric acid, borax, sodium tetraborate, phenyl boronic acid, butyl boronic acid and combinations thereof.

Abstract: A print medium suitable for inkjet web press printing is disclosed herein. The print medium includes a paper substrate and an ink-receiving layer coated onto at least one surface of the paper substrate. The ink-receiving layer includes: two different inorganic pigments with different particle sizes; a binder; a water-soluble metallic salt; and a colorant durability enhancer selected from the group consisting of boric acid, borax, sodium tetraborate, phenyl boronic acid, butyl boronic acid and combinations thereof.

Abstract: A coated medium for inkjet printing, which includes a supporting substrate and a coating layer formed on at least one side thereof. The coating layer includes at least one binder and at least two different inorganic pigments: modified calcium carbonate (MCC) and either precipitated calcium carbonate (PCC) or clay.

Abstract: Disclosed are a method, apparatus, and program product for routing an electronic design using double patenting that is correct by construction. The layout that has been routed will by construction be designed to allow successful manufacturing with double patenting, since the router will not allow a routing configuration in the layout that cannot be successfully manufactured with double patterning.

Abstract: An inkjet recording material which comprises a supporting substrate, a first bottom base coat applied to at least one surface of said substrate, and a second topcoat layer applied over said base coat. In said inkjet recording material, the base coat includes a combination of at least three pigments and the topcoat layer comprises pigments selected from the group consisting of fumed silica, silica gel, precipitated silica, colloidal silica, fumed alumina, boehmite, pseudo-boehmite or a mixture thereof.

Abstract: A coated medium for inkjet printing is disclosed. The coated medium includes a coating layer formed on at least one side of a supporting substrate. The coating layer includes precipitated calcium carbonate with an average particle size of less than about 1 micron, silica with a surface area of greater than 100 m2/g, a third inorganic pigment with an average particle size greater than that of precipitated calcium carbonate and selected from the group consisting of ground calcium carbonate (GCC) and clays, and at least one binder, wherein silica is present in an amount of at least 15 parts based on 100 parts of inorganic pigments in total.

Abstract: Disclosed is a method, system, and computer program product for implementing controlled breaks using sub-resolution assist features. Sub-resolution bridging features are added to implement controlled breaks between features on the layout. The bridging features may also be used to facilitate or optimize multiple mask/exposure techniques that split a layout or features on a layout to address pitch problems.

Abstract: A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure.

Abstract: A semiconductor chip mounting component includes a support structure adapted to engage a semiconductor chip. The support structure has a top surface, a bottom surface, and a gap extending through the support structure for defining first and second portions of the support structure on opposite sides of the gap. The support structure includes at least one elongated bus disposed alongside the gap, on the second portion of the support structure. The support structure includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the first portion of the support structure, and a second end secured to the bus. Each lead includes a frangible section disposed between the first and second ends of the connection section, the frangible section having a cross-sectional area that is smaller than a cross-sectional area of the connection section. The gap is open at the bottom surface of the support structure.

Abstract: A semiconductor chip mounting component includes a support having a top surface, a bottom surface, a central portion, a peripheral portion surrounding the central portion, and a gap extending through the support structure between the top and bottom. The component includes a plurality of electrically conductive leads, each lead having a connection section extending across the gap, the connection section having a first end disposed on the support structure on one side of the gap, a second end secured to the support structure on an opposite side of the gap, and a frangible section between the first and second ends. The component also includes at least one elongated bus disposed on the peripheral portion of the support structure alongside the gap, whereby each lead extends across the gap and is connected to the bus.

Abstract: A connection component for electrically connecting a semiconductor chip to a support substrate incorporates a preferably dielectric supporting structure defining gaps. Leads extend across these gaps so that the leads are supported on both sides of the gap. The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section adjacent one side of the gap connecting one end of the lead connection section to a bus extending alongside the gap. The frangible section is broken when the lead is engaged with the contact.

Abstract: A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact.

Abstract: A method for creating an interface between a chip and chip carrier includes spacing the chip a given distance above the chip carrier, and then introducing a liquid in the gap between the chip and carrier. Preferably, the liquid is an elastomer which is hardened into a resilient layer after its introduction into the gap. In another preferred embodiment, the terminals on a chip carrier are planarized or otherwise vertically positioned by deforming the terminals into set vertical locations with a plate, and then hardening a liquid between the chip carrier and chip.