Abstract: Devices, systems and methods for encoding information using optical components are described. An example photonic filtered sampler includes a spectral shaper configured to receive an optical pulse train, a dispersive element positioned to receive an output of the spectral shaper and to expand spectral contents thereof in time, and a modulator configured to receive an output of the dispersive element and a radio frequency (RF) signal, and to produce a modulated output optical signal in accordance with the RF signal. In this configuration, one or more characteristics of the modulated output optical signal is determined based on a spectral shape provided by the spectral shaper and dispersive properties of the dispersive element.

Abstract: Devices, systems and methods for encoding information using optical components are described. An example photonic filtered sampler includes a spectral shaper configured to receive an optical pulse train, a dispersive element positioned to receive an output of the spectral shaper and to expand spectral contents thereof in time, and a modulator configured to receive an output of the dispersive element and a radio frequency (RF) signal, and to produce a modulated output optical signal in accordance with the RF signal. In this configuration, one or more characteristics of the modulated output optical signal is determined based on a spectral shape provided by the spectral shaper and dispersive properties of the dispersive element.

Abstract: The present invention relates to a control system (49) for controlling a target ride height of a vehicle (1). The control system (49) is configured to set a target off-road ride height (hOFF) in dependence on one or more vehicle operating parameters. The target off-road ride height (hOFF) is set upon receipt of a driving mode signal signalling that an off-road driving mode has been selected. Aspects of the present invention also relate to a vehicle and a method of controlling a target ride height of a vehicle.

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

Abstract: An electronic controller (10) for a motor vehicle (100), the controller being configured to determine when at least one wheel (111, 112, 114, 115) has lost traction, wherein when the controller (10) determines that at least one wheel (111, 112, 114, 115) has lost traction the controller (10) is configured to provide an output to a driver indicative of the at least one wheel (111, 112, 114, 115) that has lost traction.

Abstract: Provided herein are intermediates and processes useful for facile synthesis of compounds of Formula 2: wherein R1 is C(O)R2; R2 is alkyl optionally substituted with 1-5 halogens; G is phenyl or a 5-6 membered heteroaryl optionally substituted with 1-2 R3; and each R3 is independently C1-C6 alkyl, CN, C1-C6 alkyl-CN, 3-6 membered cycloalkyl, or 4-6 membered heterocycloalkyl.

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

Abstract: An approach is provided in which the approach maps a set of question nodes and a set of expert nodes to an embedding space. The set of question nodes corresponds to a set of questions and the set of expert nodes corresponds to a set of experts in a CQA network. The approach maps a new question to the embedding space based on analyzing the new question against the set of questions, and selects a subset of the set of expert nodes based on their location in the embedding space relative to the mapping of the new question. The approach transmits the question to a subset of the set of experts that correspond to the subset of expert nodes.

Abstract: An approach is provided in which the approach maps a set of question nodes and a set of expert nodes to an embedding space. The set of question nodes corresponds to a set of questions and the set of expert nodes corresponds to a set of experts in a CQA network. The approach maps a new question to the embedding space based on analyzing the new question against the set of questions, and selects a subset of the set of expert nodes based on their location in the embedding space relative to the mapping of the new question. The approach transmits the question to a subset of the set of experts that correspond to the subset of expert nodes.

Abstract: A method for determining the likelihoods of a cue sport player completing a run of shots for each of a plurality of non-break ball patterns is provided. The method initially involves operating a computer to retrieve a non-break ball pattern of the plurality of non-break ball patterns and to then facilitate the positioning of balls on a cue sport table in accordance with the non-break ball pattern. The positioning may be accomplished by use of a projector under control of the computer that projects ball positioning patterns on the sport table. The progress of the cue sport player through a run of the balls on the table is then monitored and the outcome of that progress, e.g. the number of balls in a run that are pocketed are recorded in association with the current non-break ball pattern.

Abstract: The present invention relates to a control system (49) for controlling a target ride height of a vehicle (1). The control system (49) is configured to set a target off-road ride height (hOFF) in dependence on one or more vehicle operating parameters. The target off-road ride height (hOFF) is set upon receipt of a driving mode signal signalling that an off-road driving mode has been selected. Aspects of the present invention also relate to a vehicle and a method of controlling a target ride height of a vehicle.

Abstract: The present invention relates to a control system (49) for controlling a target ride height of a vehicle (1). The control system (49) is configured to set a target off-road ride height (hOFF) in dependence on one or more vehicle operating parameters. The target off-road ride height (hOFF) is set upon receipt of a driving mode signal signaling that an off-road driving mode has been selected. Aspects of the present invention also relate to a vehicle and a method of controlling a target ride height of a vehicle.

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

Abstract: Provided herein are intermediates and processes useful for facile synthesis of compounds of Formula 2: wherein R1 is C(O)R2; R2 is alkyl optionally substituted with 1-5 halogens; G is phenyl or a 5-6 membered heteroaryl optionally substituted with 1-2 R3; and each R3 is independently C1-C6 alkyl, CN, C1-C6 alkyl-CN, 3-6 membered cycloalkyl, or 4-6 membered heterocycloalkyl.

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

Abstract: An identity provider IP service provides an optimized sign out experience for a user accessing a single account service. The IP service designates a first account of a service as signed in based on first credentials provided by a user. The IP service provides a first security token for the first account to the service. Upon receiving a first sign out notification, the IP service determines whether the user wants to switch to a second account of the service. Upon determining that the user wants to switch to the second account, the IP service designates the second account as signed in based on second credentials provided by the user, provides a second security token for the second account to the service, and designates the first account as soft signed out so that the user can switch to the first account without re-providing the first credentials.

Abstract: A method for determining the likelihoods of a cue sport player completing a run of shots for each of a plurality of non-break ball patterns is provided. The method initially involves operating a computer to retrieve a non-break ball pattern of the plurality of non-break ball patterns and to then facilitate the positioning of balls on a cue sport table in accordance with the non-break ball pattern. The positioning may be accomplished by use of a projector under control of the computer that projects ball positioning patterns on the sport table. The progress of the cue sport player through a run of the balls on the table is then monitored and the outcome of that progress, e.g. the number of balls in a run that are pocketed are recorded in association with the current non-break ball pattern.

Abstract: An electronic controller (10) for a motor vehicle (100), the controller being configured to determine when at least one wheel (111, 112, 114, 115) has lost traction, wherein when the controller (10) determines that at least one wheel (111, 112, 114, 115) has lost traction the controller (10) is configured to provide an output to a driver indicative of the at least one wheel (111, 112, 114, 115) that has lost traction.

Abstract: A method for bonding two superconducting integrated circuits (“chips”), such that the bonds electrically interconnect the chips. A plurality of indium-coated metallic posts may be deposited on each chip. The indium bumps are aligned and compressed with moderate pressure at a temperature at which the indium is deformable but not molten, forming fully superconducting connections between the two chips when the indium is cooled down to the superconducting state. An anti-diffusion layer may be applied below the indium bumps to block reaction with underlying layers. The method is scalable to a large number of small contacts on the wafer scale, and may be used to manufacture a multi-chip module comprising a plurality of chips on a common carrier. Superconducting classical and quantum computers and superconducting sensor arrays may be packaged.

Abstract: This invention relates to a metrological scanning probe microscope system combining an SPM which employs an optical lever arrangement to measure displacement of the probe indirectly with another SPM which measures the displacement of the probe directly through the use of an interferometric detection scheme.