Patents by Inventor Jaswant Sandhu

Jaswant Sandhu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8979564
    Abstract: A method of manufacture of a self-cleaning socket system includes: providing a base plate having a gas pocket with a dimple; and coupling a pin plate having a compressed gas port to the base plate with the compressed gas port aligned with the dimple.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 17, 2015
    Assignee: Data I/O Corporation
    Inventor: Jaswant Sandhu
  • Patent number: 8876536
    Abstract: A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: November 4, 2014
    Assignee: Data I/O Corporation
    Inventors: Jaswant Sandhu, Robert S. Francis
  • Publication number: 20140273574
    Abstract: A method of manufacture of a self-cleaning socket system includes: providing a base plate having a gas pocket with a dimple; and coupling a pin plate having a compressed gas port to the base plate with the compressed gas port aligned with the dimple.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Data I/O Corporation
    Inventor: Jaswant Sandhu
  • Publication number: 20130224970
    Abstract: A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener.
    Type: Application
    Filed: February 29, 2012
    Publication date: August 29, 2013
    Applicant: DATA I/O CORPORATION
    Inventors: Jaswant Sandhu, Robert S. Francis
  • Publication number: 20040179932
    Abstract: A robot constructed according to the present disclosure is adapted to grasp and move a plurality of wafers simultaneously. Such robot includes movable arm and wrist rotatably mounted thereto, with a multi-wafer robotic hand coupled to the wrist of the robot. Wafers can be transferred by inserting end effectors between the wafers in a receptacle, grasping the desired wafers, relocating the hand to another wafer receptacle, and releasing of the wafers into the second receptacle.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 16, 2004
    Inventors: Jaswant Sandhu, Toshi Kono, Osamu Komiyaji, Robert Hosack, Keith Berdogin, Neal Martin
  • Publication number: 20040013503
    Abstract: A robot constructed according to the present disclosure is adapted to grasp and move a plurality of wafers simultaneously. Such robot includes movable arm and wrist rotatably mounted thereto, with a multi-wafer robotic hand coupled to the wrist of the robot. Wafers can be transferred by inserting end effectors between the wafers in a receptacle, grasping the desired wafers, relocating the hand to another wafer receptacle, and releasing of the wafers into the second receptacle.
    Type: Application
    Filed: July 22, 2002
    Publication date: January 22, 2004
    Inventors: Jaswant Sandhu, Toshi Kono, Osamu Komiyaji, Robert Hosack, Keith Berdogin, Neal Martin