Abstract: This invention relates to degradation of biomass with a peroxide in the presence of a metal catalyst. The process can result in ethanol production from cellulosic biomass, fuel gases, useful chemicals and biochemicals from decomposition products, heat and/or pressure for direct use, and electricity generation.

Abstract: Compositions suitable for removing photoresist, probing ink and wafer bonding adhesive from a substrate containing one or more (C6-C16)olefins, one or more (C1-C6)alkoxybenzenes, and one or more organic sulfonic acid compounds are provided. Such compositions show reduced metal corrosion, low toxicity and rapid removal rates of both photoresists and probing inks.

Abstract: Compositions for the removal of polymeric material from a substrate are provided where the compositions include a polyol compound selected from (C3-C20)alkanediols, substituted (C3—C20)alkanediols, (C3-C20)alkanetriols or substituted (C3-C20)alkanetriols, a glyco ether, at least 5% wt water based on the total weight of the composition, and a fluoride salt selected from ammonium fluoride, ammonium bifluoride, ammonium-tetramethylammonium bifluoride or mixtures thereof. Methods of removing polymeric material using these compositions are also provided.

Abstract: Disclosed are compositions useful for the removal of polymeric material from substrates, such as electronic devices. The compositions of the present invention are particularly suitable for removing polymer residues from advanced magnetic devices. Also disclosed are methods of removing such polymeric material.

Abstract: Disclosed are compositions and methods for removing photoresist and probing ink from a substrate. Such compositions and methods show reduced metal corrosion, low toxicity and rapid removal rates of both photoresists and probing inks.

Abstract: A mixture of a dibasic ester (DBE), an alcohol, a polar solvent and water to remove photoresist from a flat panel substrate. Photoresist is effectively removed at low temperature with this non-phenolic, non-halogenated stripper solution.

Abstract: Composition and method of making a combustible organic mixture used to generate a colorful flame that is environmentally safe and non toxic. In accordance with the invention there is provided a fuel blend mixture of hydrocarbons, alcohols, glycols or glycol ethers with a color flame generator in the form of an organometallic complex such as acetyl acetonate complexes of alkaline, alkaline earth or transition metals such as lithium, cesium, sodium, and copper acetyl acetonate complexes. The homogenous material can be used as a fuel in various types of candles and lantern devices to generate flames of red, yellow, blue, green or purple color and variations thereof depending on the organometallic complex that is used.

Abstract: Disclosed are compositions useful for the removal of plasma etching polymeric residue from substrates, such as electronic devices. Also disclosed are methods of removing such plasma etching polymeric residue.

Abstract: A method for removing photoresist, probing ink and wafer bonding adhesive from a substrate using one or more (C6-C16)olefins, one ore more (C1-C6)alkoxybenzenes, and one ore more organic sulfonic acid compounds is provided.

Abstract: Disclosed are compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices. The compositions and methods disclosed are particularly suitable for removing polymer residues from advanced integrated circuit devices with reduced corrosion of metal surfaces.

Abstract: A mixture of hydroxylamine partially neutralized with a weak carboxylic acid and an organic solvent such as an alkyl sulfoxide, a pyrrolidinone or a sulfone removes hardened photoresist and polymeric photoresist residues from a substrate with reduced metal corrosion.

Abstract: Disclosed are compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices. The compositions and methods disclosed are particularly suitable for removing polymer residues from advanced integrated circuit devices with reduced corrosion of metal surfaces.

Abstract: Disclosed are compositions and methods useful for the removing polymer stripping compositions from substrates without formations of undesirable precipitate in the rinse solution. The compositions of the present invention are particularly suitable for removing residues of stripping compositions used to remove polymer residues from plasma etch processes.

Abstract: A mixture of hydroxylamine partially neutralized with a weak carboxylic acid and an organic solvent such as an alkyl sulfoxide, a pyrrolidinone or a sulfone removes hardened photoresist and polymeric photoresist residues from a substrate with reduced metal corrosion.

Abstract: Disclosed are compositions and methods useful for the removal of polymeric material from substrates, such as electronic devices. The compositions and methods of the present invention are particularly suitable for removing polymer residues from electronic devices following plasma etch processes.

Abstract: Disclosed are compositions useful for removing antireflective compositions from a substrate. Also disclosed are methods of removing antireflective compositions from a substrate using such compositions.

Abstract: A composition and method for removing probing ink and negative photoresist from a substrate with reduced metal corrosion, low toxicity and rapid removal rates. The composition includes a mixture of anisole, an alkylarylsulfonic acid, and aliphatic hydrocarbons containing 9 to 13 carbon atoms.

Abstract: High purity oximes are prepared from aqueous hydroxylamine and ketones reacted at ambient temperature without addition of impurities such as salts or acids.

Abstract: Amidoximes are prepared from aqueous hydroxylamine and nitrites to yield amidoximes. Reaction of acetonitrile with aqueous hydroxylamine at ambient temperature yields acetamidoxime crystals.

Abstract: A mixture of a dibasic ester (DBE), an alcohol, and water to remove photoresist from a silicon wafer substrate. Photoresist is effectively removed at ambient temperature with this non-phenolic, non-halogenated stripper solution. Dissolved photoresist is easily separated from the water mixture for disposal.