Patents by Inventor Javier Leija
Javier Leija has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6917523Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).Type: GrantFiled: May 19, 2004Date of Patent: July 12, 2005Assignee: Intel CorporationInventors: Mark D. Summers, Javier Leija
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Publication number: 20050091989Abstract: A cooling system for an electronic component is provided. The cooling system includes a plurality of thermoelectric elements for placement above a plurality of different areas of the electronic component. The cooling system has a plurality of conductors connected to the thermoelectric elements for providing current to the thermoelectric elements, such that the thermoelectric elements pump heat away from the respective areas. The cooling system has a control apparatus connected to the conductors for controlling current provided to the thermoelectric elements relative to one another based on heat generated at the different areas.Type: ApplicationFiled: November 4, 2003Publication date: May 5, 2005Inventors: Javier Leija, Christopher Lucero
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Publication number: 20050068737Abstract: A method and device for thermal conduction is provided. Devices and methods are shown that include the ability to dissipate increased amounts of heat due to the use of an active heat transfer device. Devices and methods are shown that share the necessary heat transfer between a passive heat transfer device and an active heat transfer device, thus increasing the amount of heat dissipated while maintaining reliability of the individual components. Devices and methods are shown that include an increased length of the heatsink which can keep large temperature differences between heat transfer structures and the heat transfer fluid such as air.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Inventors: Javier Leija, Ioan Sauciuc, Gregory Chrysler
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Publication number: 20040212953Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).Type: ApplicationFiled: May 19, 2004Publication date: October 28, 2004Inventors: Mark D. Summers, Javier Leija
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Patent number: 6765797Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: GrantFiled: December 19, 2002Date of Patent: July 20, 2004Assignee: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Patent number: 6762939Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).Type: GrantFiled: February 20, 2002Date of Patent: July 13, 2004Assignee: Intel CorporationInventors: Mark D. Summers, JavĂer Leija
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Publication number: 20030156386Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).Type: ApplicationFiled: February 20, 2002Publication date: August 21, 2003Inventors: Mark D. Summers, Javier Leija
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Publication number: 20030076657Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: ApplicationFiled: December 19, 2002Publication date: April 24, 2003Applicant: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Patent number: 6535387Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: GrantFiled: June 28, 2001Date of Patent: March 18, 2003Assignee: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Publication number: 20030011993Abstract: The present invention relates generally to apparatus and methods for the spreading and dissipation of thermal energy from heat-producing components. More particularly, it relates to a heat transfer apparatus and methods particularly useful in the electrical arts. One embodiment of a heat transfer apparatus include but not limited to, a spring-biased member comprising a first side member, a second side member, and a connecting member adapted for spring-biased removable attachment to a heat-producing device. Another embodiment of a heat transfer apparatus is a spring-biased carrier that attaches to a heat-producing device and which carries a member, such as a finned plate. Another embodiment of a heat transfer apparatus is a spring-biased member comprising fingers for conducting thermal energy to a structure. Another embodiment of a heat transfer apparatus is a spring-biased clip used to attach separate heat-spreading/dissipating members, such as a finned plate, against a heat-producing member.Type: ApplicationFiled: June 28, 2001Publication date: January 16, 2003Applicant: Intel CorporationInventors: Mark D. Summers, Karl H. Mauritz, Amber S. Bedi, William Handley, Carol Miller, Javier Leija, Daniel Dragoon
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Patent number: 6462948Abstract: A system and method for cooling multiple microprocessors located on a circuit board containing disk drives, memory and other components. This cooling system and method utilizes a blower connected to an air duct. The air duct is divided into several channels via the placement of one or more walls within their duct. Each channel of the air duct is connected to a separate heat sink affixed to each microprocessor. Ambient air blown into the air duct is divided among the channels and proceeds to absorb heat from each of the heat sinks prior to being expelled from the circuit board. The system and method utilizes minimal space on the circuit board and provides maximum cooling for each microprocessor.Type: GrantFiled: June 25, 2001Date of Patent: October 8, 2002Assignee: Intel CorporationInventors: Javier Leija, Mark D. Summers
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Patent number: 6416098Abstract: A shipping container (100) for transporting and handling a satellite (106) is disclosed. The shipping container (100) includes a support structure (102) for securing the satellite during transport, a base (116) hingedly connected to the support structure (102), and a cover (104) to protect the satellite (106) during transport, coupled to the support structure (102). The shipping container (100) also includes a upending actuator (112), a ballast arm (110), and a handling sling (108) to facilitate removal of the satellite (106) from the shipping container (100).Type: GrantFiled: November 6, 2000Date of Patent: July 9, 2002Assignee: Motorola, Inc.Inventors: W. George C. Irwin, Javier Leija, John R. McBride, Mark M. Kanne
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Patent number: 6157350Abstract: An antenna latching mechanism includes a housing with an attached antenna and a mating utility part. A collar is formed on one of the housing and the utility part and a mating stem, rotatably fitting within the collar, is formed on the other. The collar and stem define an opening and a ridge is formed in the opening. Flexible fingers, each having a cam surface, are positioned on one of the housing and the utility part to extend through the opening, with the stem coaxially positioned in the collar, so the cam surfaces engage the ridge in a releasable assembled orientation. Detent notches are defined in one of the collar and stem and a mating flexible detent finger is formed in the other to engage a selected one of the notches and provide a plurality of stable axial positions of the housing relative to the mating utility part.Type: GrantFiled: October 7, 1999Date of Patent: December 5, 2000Assignee: Motorola, Inc.Inventors: Kevin Duane House, Javier Leija, Ronald James Nordhues, Jay Robert Mitchell, Matthew Ronald Michieli
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Patent number: D472581Type: GrantFiled: August 27, 2001Date of Patent: April 1, 2003Assignee: Intel CorporationInventors: Mark D. Summers, Javier Leija, Daniel Dragoon, Cory W. Worth