Abstract: An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Abstract: A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Abstract: An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Abstract: A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Abstract: A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Abstract: A device may include a lead-frame including a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.

Abstract: A device may comprise a lead-frame comprising a first electrode and a second electrode, a carrier, a set of optical devices mechanically and electrically connected to the first electrode, and a set of electrical connections that electrically connects the second electrode to the set of optical devices. The lead-frame and the carrier may be mechanically connected to each other via a set of interlocking structures associated with the lead-frame and the carrier. The lead-frame and the set of optical devices may have matching coefficients of thermal expansion. The first electrode and the second electrode may be electrically isolated from each other.

Abstract: An emitter array, may comprise a first set of emitters that has a nominal optical output power at an operating voltage. The emitter array may comprise a second set of emitters that has substantially less than the nominal optical output power or no optical output power at the operating voltage. The first set of emitters and the second set of emitters may be interleaved with each other to form a two-dimensional regular pattern of emitters that emits a random pattern of light at the nominal optical output power at the operating voltage. The first set of emitters and the second set of emitters may be electrically connected in parallel.

Abstract: A structured light system may include a semiconductor laser to emit light and a diffractive optical element to diffract the light such that one or more diffracted orders of the light, associated with forming a structured light pattern, are transmitted by the diffractive optical element. The diffractive optical element may be arranged such that the light is to be incident on the diffractive optical element at a substantially non-normal angle of incidence. The substantially non-normal angle of incidence may be designed to cause the diffractive optical element to transmit a zero-order beam of the light outside of a field of view associated with the diffractive optical element.

Abstract: A pump laser package may include an input fiber to send signal light on a first optical path. A first lens may be arranged on the first optical path. The pump laser package may include a source to send pump light on a second optical path. A second lens and a negative lens may be arranged on the second optical path. The first lens and the negative lens may be arranged to create a virtual image associated with the pump light. The pump laser package may include an output fiber on a third optical path. The first lens may be arranged on the third optical path. The pump laser package may include a combiner to receive the signal light on the first optical path, receive the pump light on the second optical path, and send the signal light and the pump light on the third optical path.

Abstract: A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Abstract: A pump laser package may include an input fiber to send signal light on a first optical path. A first lens may be arranged on the first optical path. The pump laser package may include a source to send pump light on a second optical path. A second lens and a negative lens may be arranged on the second optical path. The first lens and the negative lens may be arranged to create a virtual image associated with the pump light. The pump laser package may include an output fiber on a third optical path. The first lens may be arranged on the third optical path. The pump laser package may include a combiner to receive the signal light on the first optical path, receive the pump light on the second optical path, and send the signal light and the pump light on the third optical path.

Abstract: A chip-scale package for an edge-emitting semiconductor device and a semiconductor device assembly including such a chip-scale package are provided. The chip-scale package includes an edge-emitting semiconductor device chip, a top submount disposed on a top surface of the chip, and a bottom submount disposed on a bottom surface of the chip. The top-submount area and the bottom-submount area are each greater than the chip area and less than or equal to about 1.2 times the chip area.

Abstract: An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

Abstract: An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

Abstract: Multi-mode diode emitters are stacked in a staircase formation to provide a spatially-multiplexed output. Improved coupling efficiency is achieved by providing tilted collimated output beams that determine an effective step height of the stepped structure. Since the effective step height is dependent on the tilt angle, a variable number of emitters can be used inside packages having a same physical step height, while still attaining high coupling efficiency.

Abstract: An array of laser diode emitters is used as an illumination source for a range imaging system. The laser diode emitters are disposed on a common substrate. When one of the emitters fails, the remaining emitters emit enough light to meet the output optical power specification. The emitters can be disposed with a tight spacing. The tight spacing facilitates packaging of the entire array into a compact single package on a common heat sink.

Abstract: A fiber coupled semiconductor device and a method of manufacturing of such a device are disclosed. The method provides an improved stability of optical coupling during assembly of the device, whereby a higher optical power levels and higher overall efficiency of the fiber coupled device can be achieved. The improvement is achieved by attaching the optical fiber to a vertical mounting surface of a fiber mount. The platform holding the semiconductor chip and the optical fiber can be mounted onto a spacer mounted on a base. The spacer has an area smaller than the area of the platform, for mechanical decoupling of thermally induced deformation of the base from a deformation of the platform of the semiconductor device. Optionally, attaching the fiber mount to a submount of the semiconductor chip further improves thermal stability of the packaged device.

Abstract: A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.

Abstract: A high field of view, low height package and wafer-level packaging process are provided. The top surface of a first wafer has recesses defined by sidewalls, with a reflector, and a floor. The reflector is incident a horizontal light path form an edge-emitting diode on the floor, directing the light path vertically. A second optically diffusing wafer receives the vertically directed light. A vertical ring to surround each recess is wafer-level fabricated on one of the wafers. The vertical ring may have a high aspect ratio to increase light diffusion. The second wafer is connected above the first such that each vertical ring encloses its corresponding recess and such that the light vertically exits the optically diffusing media after spanning the height of the vertical ring. Diode electrical connections are provided for externally controlling the diode. Individual packages are separated by double-dicing the connected wafers between the recesses.