Abstract: There is disclosed herein an apparatus for bulk-feeding electronic components which utilizes magnetic force and a rotating feeder tube to properly orient the components for presentment to an automated pick-and-place machine.

Abstract: A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.

Abstract: There is disclosed herein an intake manifold for a port-injected internal combustion engine, comprising: a manifold body 10 having an interior plenum 12, and a runner 14 extending outward from the manifold body 10, wherein the runner 14 has a distal end 16 and a passage 18 therethrough in communication with the plenum 12. The distal end 16 of the runner 14 has a socket 20 therein into which an EFI 50 may be operatively mounted, and a first keying feature 22 formed therein for aligning the EFI in a first predetermined orientation when the EFI is engaged with the socket 20 and keying feature 22. The manifold may further include a second keying feature 42 formed in the runner end 16 for aligning a coil-on-plug spark plug ignition coil 80 in a second predetermined orientation when the coil 80 is engaged with the second keying feature 42.

Abstract: A method of manufacturing an electronic circuit assembly that includes a number of electrically interconnected flexible films, each flexible film having a flexible electrical wiring circuit. The electrical wiring circuits are interconnected between film layers and the film layers are adhered to a molded backing structure. A first flexible film is formed with a pattern of flexible electrical wiring circuits created on at least one surface thereof. The first flexible film has a passage that provides an electrical connection through the flexible film. A second flexible film is formed with a pattern of flexible electrical wiring circuits created on a least one surface thereof. The second flexible film has an electrical interconnect feature that connects with the electrical passage on the first film and electrically connects the first film with the second film. The first flexible film is overlaid juxtaposed the second flexible film so that the passage is aligned adjacent the electrical interconnect feature.

Abstract: There is disclosed herein a printed circuit board onto which an electronic component heat spreader may be soldered by laser soldering, one embodiment of which comprises: a dielectric substrate 10 having a top surface 11 on which a footprint perimeter P of the component heat spreader is defined, and two or more heat spreader mounting pads 20 arranged on the substrate top surface 12. Each mounting pad 20 comprises a first portion 21 arranged on the substrate surface 12 outside of the footprint perimeter P, and a second portion 22 arranged on the substrate surface 12 inside of the footprint perimeter P contiguous with the first portion 21.

Abstract: A fluid spray nozzle that mixes a pressurized gaseous propellant and paint composition prior to being applied to a workpiece. The nozzle includes an upstream section for receiving the pressurized gaseous propellant. The nozzle directs the gaseous propellant and the fluid composition into a recirculation cavity. The gaseous propellant and fluid composition are received in a downstream section after mixing in the recirculation cavity. The recirculation cavity has lobes on opposite sides of a flow path defined in a region in the recirculation cavity between an inlet opening and the recirculation cavity. The recirculation cavity is formed by silicon micromachining the upstream section, fluid injection section, recirculation cavity and downstream section. The gaseous propellant may be accelerated to supersonic speeds prior to entering the recirculation cavity.

Abstract: There is disclosed herein a method for adhering metallizations to a substrate, comprising the steps of: (1) providing a substrate having a first surface; (2) applying a coating atop the first surface, such that the coating has a second surface bonded to the first surface, and a third surface generally conforming with the second surface; (3) etching away material from the third surface, so as to roughen and form pits in the third surface; and (4) attaching a metallization to the pits in the third surface by plating, sputtering, or similar means.

Abstract: A matrix array spray head including a valve section for controlling nozzles is disclosed. The spray head is formed by a series of alternately stacked plates having channels formed in alternate plates for supplying either pressurized gaseous propellant or a composition to be applied by the spray head. Compositions appropriate for spraying with the spray head include paint powder, liquid paint, conformal coatings, flux, water and other materials and fluids which may be atomized when combined with a high pressure gaseous stream. Flow of the composition and gaseous stream may be controlled in the valve section by means of memory metal valves having memory metal valve elements that move in response to the application of electrical current controlled by a logic control. The computer logic control of the valves provides a spray head having a computer-addressable array of tiny spray nozzles.

Abstract: An apparatus and method of assembling vehicle instrument panel structural and electronic components includes: 1) fabricating an insulative instrument panel base substrate; 2) applying a conductive pattern to the base substrate; and 3) attaching electronic components to the base substrate in electrical communication with the conductive pattern.

Abstract: An apparatus for cooling electronic devices/modules in a vehicle comprises a main ventilation duct mounted in the vehicle, and includes a blower for forcing air through the main duct. A bypass duct is provided in selective fluid communication with the main ventilation duct, and is adapted to carry electronic devices/modules to be cooled by air forced through the bypass duct. Inlet and outlet valves are provided for selectively varying the amount of air which passes through the bypass duct. The electronic devices may be positioned outside of the bypass duct, or inside the bypass duct if sealed.