Patents by Inventor Jay Guoxu Liu

Jay Guoxu Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for managing heat from an LED
    Patent number: 10290788
    Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: May 14, 2019
    Assignee: Luminus Devices, Inc.
    Inventors: Jay Guoxu Liu, Paul Panaccione
  • SYSTEMS AND METHODS FOR MANAGING HEAT FROM AN LED
    Publication number: 20110121347
    Abstract: Light-emitting devices and particularly light-emitting device assemblies that include light-emitting diodes (LEDs) as light sources are described. The methods and systems of at least some of the embodiments described herein increase the removal of thermal energy generated by the light-emitting devices.
    Type: Application
    Filed: November 24, 2009
    Publication date: May 26, 2011
    Applicant: Luminus Devices, Inc.
    Inventors: Jay Guoxu Liu, Paul Panaccione
  • Optical device package with hermetically bonded fibers
    Patent number: 6536958
    Abstract: A method for securing a glass fiber to a housing includes positioning the glass fiber in proximity to the wall of a housing and applying a quantity of solder glass frit to the surface of the glass fiber. Sufficient solder glass frit is employed so as to occupy the gap between the glass fiber and the housing. The solder glass frit has a melting point lower than that of the glass fiber. The surface of the glass fiber is not metallized. Upon heating the solder glass frit softens and adheres to both the glass fiber and the wall of the housing. The fused solder glass frit secures the glass fiber to the housing and forms an hermetic seal therebetween.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: March 25, 2003
    Assignee: TriQuint Technology Holding Co.
    Inventor: Jay Guoxu Liu
  • Optical device package with hermetically bonded fibers
    Publication number: 20020110343
    Abstract: A method for securing a glass fiber to a housing includes positioning the glass fiber in proximity to the wall of a housing and applying a quantity of solder glass frit to the surface of the glass fiber. Sufficient solder glass frit is employed so as to occupy the gap between the glass fiber and the housing. The solder glass frit has a melting point lower than that of the glass fiber. The surface of the glass fiber is not metallized. Upon heating the solder glass frit softens and adheres to both the glass fiber and the wall of the housing. The fused solder glass frit secures the glass fiber to the housing and forms an hermetic seal therebetween.
    Type: Application
    Filed: December 20, 2000
    Publication date: August 15, 2002
    Inventor: Jay Guoxu Liu