Patents by Inventor Jay H. Ambrose
Jay H. Ambrose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11828536Abstract: A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.Type: GrantFiled: April 8, 2020Date of Patent: November 28, 2023Assignee: Lockheed Martin CorporationInventors: Douglas V. McKinnon, Jay H. Ambrose, Spencer K. Connor, Bronson Murray
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Patent number: 11745901Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.Type: GrantFiled: January 3, 2020Date of Patent: September 5, 2023Assignee: LOCKHEED MARTIN CORPORATIONInventors: Jay H. Ambrose, Rolland Holmes
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Publication number: 20210318074Abstract: A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.Type: ApplicationFiled: April 8, 2020Publication date: October 14, 2021Inventors: Douglas V. McKinnon, Jay H. Ambrose, Spencer K. Connor, Bronson Murray
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Publication number: 20200223565Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.Type: ApplicationFiled: January 3, 2020Publication date: July 16, 2020Inventors: Jay H. AMBROSE, Rolland HOLMES
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Patent number: 10602635Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.Type: GrantFiled: January 19, 2018Date of Patent: March 24, 2020Assignee: Lockheed Martin CorporationInventors: John Ditri, Jay H. Ambrose
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Patent number: 10538345Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.Type: GrantFiled: December 17, 2015Date of Patent: January 21, 2020Assignee: Lockheed Martin CorporationInventors: Jay H. Ambrose, Rolland Holmes
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Publication number: 20190230808Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.Type: ApplicationFiled: January 19, 2018Publication date: July 25, 2019Applicant: Lockheed Martin CorporationInventors: John Ditri, Jay H. Ambrose
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Patent number: 9315280Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.Type: GrantFiled: November 20, 2012Date of Patent: April 19, 2016Assignee: Lockheed Martin CorporationInventors: Jay H. Ambrose, Rolland Holmes
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Publication number: 20160102921Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.Type: ApplicationFiled: December 17, 2015Publication date: April 14, 2016Inventors: Jay H. AMBROSE, Rolland HOLMES
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Patent number: 5590538Abstract: A stacked multistage Joule-Thomson (J-T) cryostat is described in which each stage comprises a thermally conducting material plate member with fluid passages formed therein and in which the stages are stacked one above the other but separated from each other by thermally insulating standoff supports. Each successive stage in the stack is cooled to successively lower temperature zones by J-T expansion and liquefaction of different coolant gases. Each stage has a restricting passageway connected to a different high pressure gas coolant supply and forming a throttle valve opening into two-phase (liquid-vapor) coolant reservoir passages. The reservoir passages in all but the coldest stage are in heat exchange relation with the high pressure supply passages of the lower boiling temperature coolant gases. The coldest stage is in heat exchange relation with a cold surface on which a device to be cooled can be mounted.Type: GrantFiled: November 16, 1995Date of Patent: January 7, 1997Assignee: Lockheed Missiles and Space Company, Inc.Inventors: Ike C. Hsu, Jay H. Ambrose