Patents by Inventor Jay H. Ambrose

Jay H. Ambrose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11828536
    Abstract: A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: November 28, 2023
    Assignee: Lockheed Martin Corporation
    Inventors: Douglas V. McKinnon, Jay H. Ambrose, Spencer K. Connor, Bronson Murray
  • Patent number: 11745901
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: September 5, 2023
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Jay H. Ambrose, Rolland Holmes
  • Publication number: 20210318074
    Abstract: A panel assembly for use with a spacecraft includes a payload, a radiator panel and a heat pipe. The payload is configured to generate waste heat during operation. The radiator panel is spaced apart from the payload and is configured to dissipate waste heat. The heat pipe is coupled to the payload and the radiator panel. The heat pipe includes a compliant portion to permit the radiator panel to move relative to the payload. Further the heat pipe is configured to transfer waste heat from the payload to the radiator panel.
    Type: Application
    Filed: April 8, 2020
    Publication date: October 14, 2021
    Inventors: Douglas V. McKinnon, Jay H. Ambrose, Spencer K. Connor, Bronson Murray
  • Publication number: 20200223565
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Application
    Filed: January 3, 2020
    Publication date: July 16, 2020
    Inventors: Jay H. AMBROSE, Rolland HOLMES
  • Patent number: 10602635
    Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.
    Type: Grant
    Filed: January 19, 2018
    Date of Patent: March 24, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: John Ditri, Jay H. Ambrose
  • Patent number: 10538345
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Grant
    Filed: December 17, 2015
    Date of Patent: January 21, 2020
    Assignee: Lockheed Martin Corporation
    Inventors: Jay H. Ambrose, Rolland Holmes
  • Publication number: 20190230808
    Abstract: An electronics circuit card system includes a flexible elongated hollow receptacle; a working fluid disposed within the flexible elongated hollow receptacle; one or more wicking structures formed within an interior hollow region of the flexible elongated hollow receptacle, wherein the one or more wicking structures are configured to circulate the working fluid within the flexible elongated hollow receptacle and expand the flexible elongated hollow receptacle against an electronics circuit card; and a chassis configured to hold the flexible elongated hollow receptacle against the electronics circuit card.
    Type: Application
    Filed: January 19, 2018
    Publication date: July 25, 2019
    Applicant: Lockheed Martin Corporation
    Inventors: John Ditri, Jay H. Ambrose
  • Patent number: 9315280
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: April 19, 2016
    Assignee: Lockheed Martin Corporation
    Inventors: Jay H. Ambrose, Rolland Holmes
  • Publication number: 20160102921
    Abstract: A heat pipe has an evaporator portion, a condenser portion, and at least one flexible portion that is sealingly coupled between the evaporator portion and the condenser portion. The flexible portion has a flexible tube and a flexible separator plate held in place within the flexible tube so as to divide the flexible tube into a gas-phase passage and a liquid-phase artery. The separator plate and flexible tube are configured such that the flexible portion is flexible in a plane that is perpendicular to the separator plate.
    Type: Application
    Filed: December 17, 2015
    Publication date: April 14, 2016
    Inventors: Jay H. AMBROSE, Rolland HOLMES
  • Patent number: 5590538
    Abstract: A stacked multistage Joule-Thomson (J-T) cryostat is described in which each stage comprises a thermally conducting material plate member with fluid passages formed therein and in which the stages are stacked one above the other but separated from each other by thermally insulating standoff supports. Each successive stage in the stack is cooled to successively lower temperature zones by J-T expansion and liquefaction of different coolant gases. Each stage has a restricting passageway connected to a different high pressure gas coolant supply and forming a throttle valve opening into two-phase (liquid-vapor) coolant reservoir passages. The reservoir passages in all but the coldest stage are in heat exchange relation with the high pressure supply passages of the lower boiling temperature coolant gases. The coldest stage is in heat exchange relation with a cold surface on which a device to be cooled can be mounted.
    Type: Grant
    Filed: November 16, 1995
    Date of Patent: January 7, 1997
    Assignee: Lockheed Missiles and Space Company, Inc.
    Inventors: Ike C. Hsu, Jay H. Ambrose