Abstract: A conformable, gel-like pad, preferably of silicone, with a thermally conductive additive conducts heat away from a packaged electronic power device with which it is in contact. Formed by adding particles of a thermally conductive material such as aluminum powder, nickel, aluminum oxide, iron oxide, beryllium oxide, silver, etc., to a mixture of silicone resins and curing agents poured into a mold, the molded pad can be formed to accommodate virtually any geometry and size of electronic component to provide a custom-fit at little cost. A thin, solid sheet of a thermally conductive metal such as aluminum positioned in contact with a surface of the conformable pad further increases heat removal. Another embodiment contemplates a metallic foil disposed in contact with a surface of or within the conformable pad and extending therefrom which can be coupled to a heat sink or to neutral ground potential for radiation shielding.

Abstract: A method is described for plating the inner and outer circumferences of a cylindrical dielectric element used in an isolator, and for then assembling the dielectric element with other components to complete the isolator. The dielectric element is first sensitized and activated so that a subsequently applied plating will adhere thereto. The end faces of the dielectric element are then covered with a plating resist, and the element is immersed in a metal plating bath to plate the inner and outer circumferences of the dielectric element. Having been plated, the dielectric element and other components of the isolator are assembled within a hollow connector and joined thereto using a solder sheath.