Patents by Inventor Jay Mathews
Jay Mathews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11326366Abstract: A fence vegetation barrier assembly for inhibiting vegetation from growing beneath a fence includes a plurality of panels that is each elongated. Each of the panels is positionable beneath a fence having each of the panels extending between a respective pair of fence posts to inhibit vegetation from growing beneath the fence. A plurality of first trim units is each coupled to a respective one of the panels. A plurality of second trim units is each coupled to a respective one of the panels. Each of the second trim units engages the first trim unit on an adjacent one of the panels when the panels are positioned beneath the fence to enhance the visual appeal of the fence posts.Type: GrantFiled: July 29, 2020Date of Patent: May 10, 2022Inventors: Jay Mathews, Trudy Paige
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Publication number: 20220034119Abstract: A fence vegetation barrier assembly for inhibiting vegetation from growing beneath a fence includes a plurality of panels that is each elongated. Each of the panels is positionable beneath a fence having each of the panels extending between a respective pair of fence posts to inhibit vegetation from growing beneath the fence. A plurality of first trim units is each coupled to a respective one of the panels. A plurality of second trim units is each coupled to a respective one of the panels. Each of the second trim units engages the first trim unit on an adjacent one of the panels when the panels are positioned beneath the fence to enhance the visual appeal of the fence posts.Type: ApplicationFiled: July 29, 2020Publication date: February 3, 2022Inventors: Jay Mathews, Trudy Paige
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Patent number: 8532445Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: GrantFiled: October 18, 2010Date of Patent: September 10, 2013Assignee: DigitalOptics Corporation EastInventors: James E. Morris, Hongtao Han, Adam Fedor, Robert TeKolste, Jay Mathews, Michael R. Feldman
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Publication number: 20120025212Abstract: Photodiode devices with GeSn active layers can be integrated directly on p+ Si platforms under CMOS-compatible conditions. It has been found that even minor amounts of Sn incorporation (2%) dramatically expand the range of IR detection up to at least 1750 nm and substantially increases the absorption. The corresponding photoresponse can cover of all telecommunication bands using entirely group IV materials.Type: ApplicationFiled: September 16, 2009Publication date: February 2, 2012Applicant: Arizona Board of Regents, a body corporate acting for and on behalf of Arizona State UniversityInventors: John Kouvetakis, Jose Menendez, Radek Roucka, Jay Mathews
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Publication number: 20110033152Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Inventors: JAMES E. MORRIS, Hongtao Han, Adam Fedor, Robert TeKolste, Jay Mathews, Michael R. Feldman
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Patent number: 7817883Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: GrantFiled: November 17, 2008Date of Patent: October 19, 2010Assignee: Tessera North America, Inc.Inventors: James Morris, Hongtao Han, Adam Fedor, Robert Te Kolste, Jay Mathews, Michael Feldman
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Publication number: 20090225422Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.Type: ApplicationFiled: May 18, 2009Publication date: September 10, 2009Applicant: TESSERA NORTH AMERICA, INC., (formerly Digital Optics Corporation)Inventors: Thomas J. Suleski, Robert Russell Boye, William Delaney, Harris Miller, James Morris, Hongtao Han, Jay Mathews
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Publication number: 20090103866Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: ApplicationFiled: November 17, 2008Publication date: April 23, 2009Inventors: James Morris, Hongtao Han, Adam Fedor, Robert Te Kolste, Jay Mathews, Michael Feldman
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Patent number: 7466502Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: GrantFiled: December 7, 2005Date of Patent: December 16, 2008Assignee: Tessera North America, Inc.Inventors: James E. Morris, Hongtao Han, Adam Fedor, Robert TeKolste, Jay Mathews, Michael R. Feldman
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Publication number: 20080013886Abstract: An optical assembly includes a first transparent substrate having first and second surfaces, a second transparent substrate having substantially parallel third and fourth surfaces, a reflective portion on the second transparent substrate, a plurality of filters between the first substrate and the reflective portion, the plurality of filters filtering light beams incident thereon, the plurality of filters and the reflective portion forming a bounce cavity within the second transparent substrate, a collimating lens for collimating light beams to be input to the bounce cavity, a tilt mechanism for introducing tilt to light beams input to the bounce cavity; an input port receiving light beams and an output port transmitting light beams. The tilt mechanism may be between the first and second substrate.Type: ApplicationFiled: December 7, 2005Publication date: January 17, 2008Inventors: James Morris, Hongtao Han, Adam Fedor, Robert TeKolste, Jay Mathews, Michael Feldman
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Publication number: 20070200132Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.Type: ApplicationFiled: April 23, 2007Publication date: August 30, 2007Applicant: DIGITAL OPTICS CORPORATIONInventors: Alan Kathman, Hongtao Han, Jay Mathews, John Hammond
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Patent number: 7208771Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.Type: GrantFiled: September 21, 2004Date of Patent: April 24, 2007Assignee: Digital Optics CorporationInventors: Alan D Kathman, Hongtao Han, Jay Mathews, John Barnett Hammond
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Patent number: 7049682Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.Type: GrantFiled: July 16, 2003Date of Patent: May 23, 2006Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AGInventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan
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Publication number: 20050094276Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.Type: ApplicationFiled: December 7, 2004Publication date: May 5, 2005Applicant: DIGITAL OPTICS CORPORATIONInventors: Thomas Suleski, Robert Boye, William Delaney, Harris Miller, James Morris, Hongtao Han, Jay Mathews
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Patent number: 6869754Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.Type: GrantFiled: November 28, 2001Date of Patent: March 22, 2005Assignee: Digital Optics Corp.Inventors: Thomas J. Suleski, Robert Russell Boye, William Delaney, Harris Miller, James Morris, Hongtao Han, Jay Mathews
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Publication number: 20050035463Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.Type: ApplicationFiled: September 21, 2004Publication date: February 17, 2005Applicant: DIGITAL OPTICS CORPORATIONInventors: Alan Kathman, Hongtao Han, Jay Mathews, John Hammond
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Patent number: 6798931Abstract: A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active optical element, with the different dimensions of the substrates forming the structure allowing access for the electrical interconnections for the active optical elements. Different dicing techniques may be used to realize the uneven structures.Type: GrantFiled: October 23, 2001Date of Patent: September 28, 2004Assignee: Digital Optics Corp.Inventors: Alan D Kathman, Hongtao Han, Jay Mathews, John Barnett Hammond
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Patent number: 6777311Abstract: A thick wafer is diced by partially dicing a first side to form a first dice, flipping the wafer so that the first side is now in contact with a dicing tape, and dicing a second side. The dicing of the second side may be achieved by aligning a dicing tool to the first dice and/or alignment marks on the wafer. The thick wafer may be a composite wafer including two or more wafers bonded together. These two wafers may be different thicknesses and/or different materials.Type: GrantFiled: March 5, 2002Date of Patent: August 17, 2004Assignee: Digital Optics Corp.Inventors: Hongtao Han, Jay Mathews
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Patent number: 6686649Abstract: A transceiver package includes a substrate having an upper surface. An electronic component is mounted to the upper surface of the substrate. A shield encloses the electronic component and shields the electronic component from radiation. The transceiver package further includes an antenna and a dielectric cap. The dielectric cap is interposed between the shield and the antenna, the shield being a ground plane for the antenna.Type: GrantFiled: May 14, 2001Date of Patent: February 3, 2004Assignees: Amkor Technology, Inc., Tyco Electronics Logistics AGInventors: Douglas Jay Mathews, Robert Joseph Hill, Michael Paul Gaynor, Ronald James Schoonejongen, John Armando Miranda, Christopher Marc Scanlan
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Publication number: 20030076589Abstract: A passive optical element is transferred into a substrate already having features with a vertical dimension thereon. The features may be another passive optical element, an active optical element, a dichroic layer, a dielectric layer, alignment features, metal portions. A protective layer is provided over the feature during the transfer of the optical element. One or more of these processes may be performed on a wafer level.Type: ApplicationFiled: November 28, 2001Publication date: April 24, 2003Inventors: Thomas J. Suleski, Robert Russell Boye, William Delaney, Harris Miller, James Morris, Hongtao Han, Jay Mathews