Patents by Inventor Jay R. Dorfman

Jay R. Dorfman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer thick film resistor compositions
    Patent number: 5470643
    Abstract: A polymer thick film resistor composition is disclosed which comprises: (1) finely divided particles of a conductive metal having a surface area of 0.3 to 3.0 m.sup.2 /g; (2) finely divided particulate material having a surface area greater than 100 m.sup.2 /g; (3) a thermoplastic resin; dissolved in (4) an organic solvent having a volatility rating of 10,000 to 50,000; wherein the composition is substantially curable within 2.5 minutes by heating to a temperature of 135.degree. C., and further wherein the volume ratio of particulate material to resin is at least 3.5, and the weight ratio of solvent to resin is 3 to 5.
    Type: Grant
    Filed: June 15, 1994
    Date of Patent: November 28, 1995
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Jay R. Dorfman
  • Method for forming via holes in multilayer circuits
    Patent number: 5294567
    Abstract: The invention is directed to a method for rapidly forming a dense pattern of via holes in multilayer electronic circuits in which via holes in the dielectric layers are formed by drilling with an excimer laser under controlled operating conditions.
    Type: Grant
    Filed: October 8, 1993
    Date of Patent: March 15, 1994
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Jay R. Dorfman, Richard R. Draudt, Thomas D. Lantzer, Arthur H. Mones, David L. Sutton
  • Process for etching polyimide substrate in formation of unsupported electrically conductive leads
    Patent number: 4986880
    Abstract: Formation of unsupported electrically conductive leads is obtained by etching of a polyimide substrate using an etching solution with a low etch ratio.
    Type: Grant
    Filed: November 29, 1989
    Date of Patent: January 22, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Jay R. Dorfman