Abstract: A method for annealing an absorber layer is disclosed, the method including contacting a surface of the absorber layer with an annealing material provided as a gel. The annealing material comprises cadmium chloride and a thickening agent. A viscosity of the gel of the annealing material is greater than or equal to 5 millipascal seconds.

Abstract: A modular furniture system includes opposing sidewalls for mounting one or more stationary or slideable components. Each sidewall includes a plurality of pairs of holes for mounting the stationary or slideable component that are aligned with corresponding holes in the opposing sidewall. A first set of mounting pins has a first end adapted to be press-fit into the holes in the opposing sidewalls and a second end adapted to support the stationary component. A second set of mounting pins has a first end adapted to be press-fit into the holes in the opposing sidewalls and a second end connected to an outer slide member for slidably mounting the slidable component. The first end of the first and second set of mounting pins is the same such that the stationary component and the slidable component are interchangeably mounted in the holes in the opposing sidewalls.

Abstract: Self-sealing assemblies and methods of establishing a fluid-seal around a medical instrument are disclosed herein.

Abstract: Self-sealing assemblies and methods of establishing a fluid-seal around a medical instrument are disclosed herein.

Abstract: A protective helmet configured to be worn by a user is provided. The helmet includes a domed shell, a visor, and at least one blinder. The visor extends forwardly from the shell. The at least one blinder includes an upper edge, a lower edge, and a body extending therebetween. The blinder is coupled to the shell such that the blinder upper edge is between the visor and the blinder lower edge. The blinder body obstructs vision of the user between the visor and the blinder lower edge.

Abstract: A memory expansion module with stacked memory packages. A memory module is implemented using stacked memory packages. Each of the stacked memory packages contains multiple memory chips, typically DRAMs (dynamic random access memory). The memory may be organized into multiple banks, wherein a given memory chip within a stacked memory package is part of one bank, while another memory chip in the same package is part of another bank. The memory module also includes a clock driver chip and a storage unit. The storage unit is configured to store module identification information, such as a serial number. The storage unit is also configured to store information correlating electrical contact pads on the module with individual signal pins on the stacked memory packages. This may allow an error to be quickly traced to a specific pin on a stacked memory package when an error is detected on the memory bus by an error correction subsystem.

Abstract: A memory module for expanding memory of a computer. The memory module comprises a printed circuit board including a connector edge having a plurality of contact pads configured to convey data signals, power and ground to and from said printed circuit board. The power and ground contact pads alternate along said connector edge with no more than four adjacent data signal contact pads without intervening power or ground contact pads. A plurality of memory devices mounted on the printed circuit board. A clock driver is coupled to each of the plurality of memory devices and is configured to receive a differential clock signal and to produce at least one single-ended clock signal for clocking the plurality of memory devices. The clock driver includes a phase-locked loop for phase-locking the at least one single-ended clock signal.

Abstract: A memory expansion module including multiple memory banks and a bank control circuit is disclosed. In one embodiment, a memory module includes a printed circuit board with a connector edge adapted for insertion in an expansion socket of a computer system. Mounted upon the circuit board is a plurality of memory chips, typically Dynamic Random Access Memory (DRAM) chips, which make up an upper bank and a lower bank of memory. A buffer circuit is mounted upon the printed circuit board, for the purpose of driving address signals, Column Address Strobe (CAS) signals, and write enable signals to each of the memory chips. Also mounted upon the printed circuit board is a bank control circuit, which is coupled to the memory chips. An address signal is used as a bank selection input to the bank control circuit, which will drive Row Address Strobe (RAS) signals to the memory chips of the selected memory bank.

Abstract: A snow tilling implement when mounted on a snowmobile and in operating position with the snowmobile in motion digs into the snow and sprays broken up snow on the heat exchanger, track, and slide rail on the underneath side of the snowmobile to cool and lubricate the same. The tilling implement can be simply an elongate rod, the proximal portion of which is advantageously bent to form a coil spring and catch arm. The catch arm abuts against the snowmobile and causes the coil spring to provide a downward force pressing the distal end of the rod into snow.